UV LED and Heater for Semiconductor Adhesive Curing
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Solution Overview
Problem
Existing energy application devices, such as ultraviolet irradiator systems, often fail to adequately cure adhesive layers on semiconductor wafers, leading to difficulties in peeling the tape without damaging the wafer.
Innovation Solution
An energy application device that combines optical energy with additional forms of energy, such as heat, vibration, or other non-optical energies, to ensure complete curing of the adhesive layer, overcoming the limitations of single-wavelength optical energy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If only optical energy (ultraviolet rays) is applied to the adhesive layer, then the curing reaction is initiated, but the adhesive layer cannot be cured enough to be easily peeled off without damaging the wafer
Solution Approach 1:
The patent combines optical energy (ultraviolet rays) with thermal energy (heat) to achieve complete curing of the adhesive layer. The heating unit is integrated with the light irradiation unit, allowing simultaneous or sequential application of both energy types to ensure the adhesive reaches full cure and can be easily peeled without wafer damage.
Solution Approach 2:
The patent changes the energy parameters by introducing thermal energy in addition to optical energy. By controlling the temperature through the heating unit, the adhesive layer receives sufficient energy to complete the curing reaction, transforming the physical state and chemical properties of the adhesive to achieve complete curing.
2Device complexity
If only ultraviolet light-emitting diodes are used, then the device structure is simple, but the adhesive layer cannot be adequately cured
Solution Approach 1:
The patent merges the ultraviolet light-emitting diode unit with a heating unit into a single integrated device. This combination maintains relative structural simplicity while adding thermal energy capability, allowing the adhesive layer to receive both optical and thermal energy for effective curing without significantly increasing device complexity.
3Reliability
If high-pressure mercury lamp is used to apply both optical and heat energy, then the adhesive layer is cured effectively, but the device complexity and energy consumption increase
Solution Approach 1:
The patent replaces the high-pressure mercury lamp system with a combination of ultraviolet light-emitting diodes and a separate heating unit. This substitution uses solid-state LED technology and independent thermal control, reducing device complexity while maintaining the dual energy application capability for effective adhesive curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combined energy approach effectively cures the adhesive layer, allowing for easy peeling of the tape without damaging the wafer, while also providing energy efficiency and a longer device lifespan.
Implementation Method 1
a first energy application unit that applies optical energy having a predetermined wavelength on the object... the object is photoreactive to ultraviolet rays... the adhesive layer is enabled to be cured by being applied with heat energy in addition to the optical energy
Implementation Method 2
the high-pressure mercury lamp applies heat energy in addition to optical energy on the adhesive layer, so that the adhesive layer is cured... the adhesive layer is enabled to be cured by being applied with heat energy in addition to the optical energy
Data Source
AI summary
An energy application device applies optical energy on an adhesion sheet by a light radiator and, subsequently, applies heat energy on the adhesion sheet by a heater. With this arrangement, even the adhesion sheet, which includes an adhesive layer having an energy barrier that cannot be overcome only with optical energy, is enabled to start a photoreaction by overcoming an energy barrier with the heat energy from the heater.