Wafer-Level UV LED Package Heat Dissipation
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Solution Overview
Problem
Conventional LED packages face challenges in miniaturization, heat dissipation, and luminous efficiency due to the use of lead frames and printed circuit boards, which also increase manufacturing time and costs, particularly for UV LEDs that generate more heat.
Innovation Solution
A wafer-level LED package is developed without a conventional lead frame or printed circuit board, featuring a semiconductor stack with conductive type semiconductor layers, contact holes, bumps, and a protective insulation layer, allowing direct formation on a circuit board with improved heat dissipation and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional LED packages use lead frames and printed circuit boards, then structural support and electrical connection are provided, but device size increases and heat dissipation performance deteriorates
Solution Approach 1:
The patent extracts and removes the lead frame and printed circuit board from the LED package structure. The semiconductor chip is directly mounted on the substrate without these intermediate components, eliminating their harmful thermal and spatial effects while maintaining structural integrity through direct bonding techniques
Solution Approach 2:
The patent merges the substrate and mounting structure into a single integrated component. The substrate serves both as the mechanical support and the electrical connection platform, combining functions that were previously separated between lead frames, PCBs, and mounting structures
2Productivity
If conventional LED packages use lead frames and printed circuit boards, then electrical connection is achieved, but manufacturing time and costs increase
Solution Approach 1:
The patent combines multiple separate manufacturing processes into a single integrated workflow. The semiconductor chip is fabricated and mounted on the substrate in one continuous process without separate lead frame attachment and PCB mounting steps, directly reducing manufacturing time and complexity
Solution Approach 2:
The patent performs preliminary integration of the semiconductor chip with the substrate during the chip fabrication process itself. Electrical connections and mechanical mounting are established in advance before final assembly, eliminating subsequent time-consuming connection steps
3Volume of moving object
If conventional LED packages use lead frames and printed circuit boards, then structural support is provided, but miniaturization is limited
Solution Approach 1:
The patent removes the bulky lead frame and PCB components that dominate the package volume. By eliminating these large structural elements, the overall package size is dramatically reduced while maintaining necessary support functions through the compact substrate design
Solution Approach 2:
The patent employs thin-film bonding techniques and compact substrate structures to provide structural support without the bulk of traditional lead frames and PCBs. The thin-film approach enables mechanical strength with minimal thickness and volume
4Use of energy by moving object
If conventional LED packages use lead frames and printed circuit boards, then electrical connection is achieved, but luminous efficiency deteriorates due to light absorption
Solution Approach 1:
The patent extracts and removes the lead frame and PCB components that absorb and block light. By eliminating these light-absorbing materials from the optical path, luminous efficiency is improved while maintaining electrical connection functions through the transparent or reflective substrate design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables miniaturization, enhanced heat dissipation, and reduced manufacturing time and costs for LED modules, particularly for UV LEDs, by eliminating the need for traditional packaging components and improving light extraction efficiency.
Implementation Method 1
A light emitting diode (LED) is a semiconductor device that includes an N-type semiconductor and a P-type semiconductor, and emits light through recombination of holes and electrons
Implementation Method 2
a protective insulation layer covering a sidewall of the semiconductor stack
Data Source
AI summary
A UV LED package and an LED module including the same. The UV LED package includes an upper semiconductor layer; a mesa disposed under the upper semiconductor layer, having an inclined side surface, and comprising an active layer and a lower semiconductor layer; a first insulation layer covering the mesa and having an opening exposing the upper semiconductor layer; a first contact layer contacting the upper semiconductor layer through the opening of the first insulation layer; a second contact layer formed between the mesa and the first insulation layer and contacting the lower semiconductor layer; a first electrode pad and a second electrode pad disposed under the first contact layer and electrically connected to the first contact layer and second contact layer, respectively; and a second insulation layer located between the first contact layer and the first and second electrode pads, wherein the active layer emits UV light having a wavelength of 405 nm or less. With this structure, the LED package has high efficiency and high heat dissipation characteristics.