UV-LED Package Sealing Structure for Airtight Stable Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
UV-LED packaging faces issues with air tightness, glue quantity calculation, high light loss, unstable bonding, and difficulty in detecting UV light invisibility, while 3D TOF devices have problems with homogenizing layer detachment and incomplete damage detection, leading to safety concerns.
Innovation Solution
A packaging structure with a substrate, transparent cover, and dam, featuring a sealing member and protective member to enhance air tightness and stability, and a light-transmitting conductive layer for detecting homogenizing layer integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a photoelectric detector is arranged in the accommodating cavity to detect homogenizing layer integrity, then detection capability is improved, but device complexity and cost increase
Solution Approach 1:
The patent replaces the photoelectric detector (electronic/optical system) with a simple visual inspection method. The homogenizing layer is made visible through optical design so that its integrity can be detected by human eye rather than requiring complex electronic detection equipment.
Solution Approach 2:
The patent uses a simple, low-cost visual inspection method instead of expensive photoelectric detectors. The detection mechanism is essentially free (human vision) compared to the costly electronic detection system it replaces.
2Ease of manufacture
If UV-LED packaging uses traditional sealing methods, then manufacturing simplicity is maintained, but air tightness and bonding stability deteriorate
Solution Approach 1:
The patent divides the sealing function into multiple components: a sealing ring made of flexible material that fits into a groove on the substrate, and a transparent cover that presses against it. This segmented approach provides reliable sealing while keeping the manufacturing process simple.
Solution Approach 2:
The patent uses a flexible sealing ring material that can deform to accommodate manufacturing tolerances and assembly variations. The flexibility parameter of the sealing material allows the system to maintain air tightness without requiring extremely precise manufacturing.
3Temperature
If heat dissipation devices are added to LED products, then heat dissipation performance is improved, but device complexity and short circuit risk increase due to insulating layer requirements
Solution Approach 1:
The patent uses a substrate with composite structure that combines heat dissipation functionality with electrical insulation. The substrate integrates the heat dissipation device and insulating properties in a single component, eliminating the need for separate insulating layers and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves air tightness, reduces light loss, ensures stable bonding, and provides reliable safety detection, simplifying manufacturing and reducing costs by eliminating the need for photoelectric detectors and additional driving circuits.
Implementation Method 1
The homogenizing layer includes a homogenizing structure to refract laser light into a large-angle beam to protect human eyes
Implementation Method 2
The bottom of the transparent cover is provided with a bonding layer, and a front surface of the substrate is provided with a first circuit layer
Implementation Method 3
the light-emitting element is an LED chip or a laser chip
Data Source
Figure 1~1-b
Figure 1-c~1-e
Figure 2~4
AI summary
The present disclosure is suitable for the technical field of semiconductor packaging, and provides a packaging structure, an LED device and a packaging method, which comprise a substrate, a transparent cover and a dam connected to the substrate, wherein the dam, the transparent cover and the substrate are enclosed to form an assembly area; the dam comprises an outer retaining wall and an inner retaining wall, and a groove is arranged between the outer retaining wall and the inner retaining wall; the LED packaging structure further comprises a sealing member arranged in the groove; the transparent cover covers the inner retaining wall and the assembly area, and the transparent cover is inserted into the groove; the LED packaging structure further comprises a protective member arranged at the edge of the transparent cover, and the protective member is provided with a blocking part for blocking the gap between the transparent cover and the outer retaining wall, and a pressing part connected to the blocking part and capable of abutting against the upper end of the transparent cover. According to the LED packaging structure provided by the present disclosure, with the shielding of the inner retaining wall, the outer retaining wall and the blocking part, the sealing member is capable of avoiding UV irradiation, and has the advantages of both semi-inorganic packaging and fully-inorganic packaging to overcome the limitations of the two, thereby achieving better air tightness and stability.