UV LED Package Structure with Anti-Reflection Layer
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Solution Overview
Problem
Current UV LED package structures face issues with light extraction efficiency and material deterioration due to long-term UV exposure, leading to embrittlement or peeling of packaging materials.
Innovation Solution
A UV LED package structure is designed with an anti-reflection layer and optical coating-film on a substrate, featuring an optical member with an accommodation space to enhance light extraction efficiency, using materials like hafnium compounds and quartz to minimize material deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional packaging materials (polyphthalamide) are used for UV LED packages, then cost is reduced, but material deterioration and peeling occur under long-term UV exposure
Solution Approach 1:
An optical member (quartz or glass) is introduced as an intermediary component between the UV LED chip and the packaging material. This optical member has superior UV resistance and acts as a mediator that protects the packaging material from direct UV exposure while still allowing light transmission. The packaging material (polyphthalamide) is thus shielded from the harmful UV effects that would otherwise cause deterioration and peeling.
2Duration of action of stationary object
If uniformizing light distribution is used to mitigate UV concentration, then packaging material lifetime is extended, but light extraction efficiency decreases
Solution Approach 1:
Instead of uniformly distributing light across the entire packaging surface, the patent uses an optical member with specific local optical properties (refractive index, transparency to UV) that selectively manage light extraction. The optical member maintains high light extraction efficiency at the LED chip level while the packaging material below receives reduced UV intensity, thus extending its lifetime without sacrificing productivity.
3Productivity
If anti-reflection layer is added to enhance light extraction, then light-emitting efficiency is improved, but device complexity increases
Solution Approach 1:
The optical member combines multiple functions into a single component: it serves as an anti-reflection layer, a UV protective barrier, and a light extraction enhancement element. By merging these functions into one integrated component rather than using separate layers for each function, the patent improves light-emitting efficiency while minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves light-emitting efficiency of UV LED chips while preventing packaging material deterioration, achieving enhanced light extraction and extended lifespan.
Implementation Method 1
an anti-reflection layer is disposed on the UV LED for enhancing the light extraction efficiency above the UV LED chip
Implementation Method 2
The lateral UV light is reflected by the optical coating-film, passes through the accommodation space, and then passes through the optical member
Implementation Method 3
The optical member is used to concentrate light
Data Source
AI summary
The application is related to a UV LED package structure for improving light extraction efficiency. An UV LED chip is set on a substrate with an anti-flare film for increasing upward light extraction to concentrate the emitted light by an optical element. Because no glue is filled between the UV LED chip and the optical element, it will be prevented the glue from spoiling and deteriorating by the UV light from the UV LED chip. Thereby, the UV LED package structure can prevent from the light performance reducing.