UV LED Package Thermal Management via Multi-Level Architecture
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Solution Overview
Problem
Existing UV-C LED packages face challenges in thermal management due to thermal coupling issues between the UV module and other circuit elements, which affects the efficiency and reliability of UV-C light-based water purification systems.
Innovation Solution
A solid state UV output device package design featuring a multi-level architecture with a base and lid structure, where the UV module and electrical components are on different levels, allowing for effective thermal dissipation, and utilizing spring contacts for both electrical and thermal coupling, with a UV transparent window and reflecting material for beam shaping and steering, and thermal coupling elements for improved heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the UV module and electrical components are placed on the same level in a conventional package, then the device structure is simple, but thermal management becomes difficult and heat dissipation is inefficient
Solution Approach 1:
The patent transitions from a two-dimensional planar layout to a three-dimensional multi-level architecture. The UV module is mounted on the lid at a first level, while electrical components are mounted on the base at a second level. This vertical separation in the third dimension enables independent thermal management zones, allowing the UV module to dissipate heat through the lid to the surrounding environment while electrical components dissipate heat through the base, thereby resolving the thermal management contradiction without excessive complexity.
Solution Approach 2:
The package is segmented into distinct functional zones: the lid housing the UV module and the base housing the electrical components. This segmentation creates separate thermal pathways and management regions. The lid can be designed with specific thermal properties for the UV module, while the base can be optimized for electrical component cooling, allowing each segment to be thermally optimized independently for its specific function.
2Loss of energy
If thermal coupling elements are added to improve heat transfer, then thermal dissipation efficiency increases, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The spring contacts serve dual functions: providing electrical connection between the UV module and external circuitry, and simultaneously acting as thermal coupling elements to conduct heat away from the UV module. This multi-functionality eliminates the need for separate thermal management components, achieving effective heat dissipation while maintaining manufacturing simplicity and avoiding additional assembly complexity.
Solution Approach 2:
The electrical connection function and thermal management function are merged into a single component - the spring contact. By combining these two functions, the patent achieves efficient thermal coupling without adding separate thermal management components, thereby improving heat dissipation efficiency while keeping the device structure and manufacturing process relatively simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances thermal management, enabling efficient heat dissipation and maintaining optimal performance of UV-C LEDs in water purification applications by isolating electrical circuitry from heat sources while providing a thermal path for dissipation, thus improving the reliability and efficiency of UV-C light delivery.
Implementation Method 1
utilizing spring contacts for both electrical and thermal coupling
Implementation Method 2
a UV transparent or translucent window
Implementation Method 3
UV reflecting material may be provided in the chamber. The UV arrangement may direct its output downwardly and the reflector then redirects the light
Data Source
Figure 1~3
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Figure 8~9
AI summary
A solid state UV output device package comprises a base which defines a chamber in which electrical components are housed. At least two spring contacts are mounted in the chamber. A lid over the chamber has a UV transparent or translucent window, electrical connection tracks mounted over the inside of the window and a UV output arrangement mounted over the electrical connection tracks. The electrical connection tracks of the lid make electrical contact with the spring contacts. This provides a two-layer structure which provides improved thermal management.