UV LED Plasma Chamber Heating for Low-Temperature Gas Activation
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Solution Overview
Problem
Semiconductor processing operations, such as epitaxial deposition, are inefficient, non-uniform, and costly, with limited throughput and hardware footprint, and face challenges in uniform gas activation and dopant concentration, especially at low processing temperatures.
Innovation Solution
A processing chamber equipped with a plasma source and light-emitting diodes (LEDs) that emit UV light to heat the substrate, facilitating uniform gas activation and deposition, while a controller manages the process parameters for enhanced efficiency and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heating methods are used, then processing temperature can be maintained, but gas activation remains non-uniform and limited
Solution Approach 1:
The patent replaces conventional thermal conduction heating with optical heating using UV LEDs. The UV light directly activates gases through photochemical effects rather than relying on thermal conduction, enabling uniform gas activation across the substrate surface at lower processing temperatures. This substitution of heating mechanism resolves the contradiction by achieving both temperature control and uniform activation simultaneously.
Solution Approach 2:
The patent changes the physical state and activation mechanism by introducing UV light wavelength as a new parameter. Instead of relying solely on thermal energy, the system uses photons with specific energies (wavelengths) to directly activate gases. This parameter change enables gas activation at lower temperatures while maintaining uniformity, as the UV light can penetrate and activate gases uniformly across the processing chamber.
2Reliability
If higher processing temperatures are used to improve gas activation, then gas activation increases, but unintended dopant diffusion occurs and device performance deteriorates
Solution Approach 1:
The patent substitutes thermal activation with photochemical activation using UV LEDs. This replacement allows gas activation to occur through direct photon-gas interactions rather than thermal processes, enabling effective gas activation at lower temperatures that prevent dopant diffusion while maintaining device performance. The UV light provides the necessary activation energy without the harmful thermal effects.
Solution Approach 2:
The patent introduces a new activation parameter (UV light wavelength and intensity) that decouples gas activation from temperature increase. By using photons with energies matching gas molecular transition energies, the system achieves effective gas activation at lower temperatures, thereby preventing the thermal diffusion of dopants that would otherwise occur at higher temperatures.
3Reliability
If conventional plasma sources are used, then gas activation can be achieved, but processing efficiency and throughput are limited
Solution Approach 1:
The patent replaces conventional plasma generation mechanisms (requiring high power RF or microwave sources) with UV LED-based photochemical activation. This substitution dramatically reduces power consumption and enables faster processing cycles, thereby improving throughput while maintaining effective gas activation. The UV LEDs can be rapidly switched on and off, enabling precise control and faster processing speeds.
Solution Approach 2:
The patent employs UV LEDs that have long operational lifetimes and can be rapidly replaced if needed, unlike complex plasma source components. The LEDs provide sufficient activation for each processing cycle and can be quickly exchanged or adjusted, enabling higher throughput operations. The simplicity and rapid response of LEDs compared to plasma sources directly contributes to improved productivity.
4Productivity
If larger hardware dimensions are used for processing, then processing capacity increases, but facility footprint increases
Solution Approach 1:
The patent designs a processing chamber where UV LEDs can be positioned and oriented to treat multiple substrates simultaneously or sequentially. The compact LED array serves multiple functions: heating, gas activation, and process control, eliminating the need for separate large-scale plasma sources and heating systems. This multi-functionality increases processing capacity within a smaller footprint.
Solution Approach 2:
The patent utilizes the optical dimension by directing UV light along the substrate surface and through the processing chamber in various paths. This allows activation of gases and heating of substrates without requiring large physical distances or volumes, as light can traverse and interact with materials in three-dimensional space within a compact chamber configuration, thereby increasing capacity without expanding footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves reliable gas activation at low temperatures, faster growth rates, uniform film quality, and increased throughput with reduced gas consumption and waste, enhancing device performance and reducing unintended dopant diffusion.
Implementation Method 1
one or more light-emitting diodes (LEDs) operable to emit ultraviolet (UV) light heat the processing volume
Implementation Method 2
a plasma source operable to flow a plasma to the processing volume
Data Source
AI summary
The present disclosure relates to plasma generation and light-emitting diode (LED) configurations for processing chambers, and related apparatus and methods, for semiconductor manufacturing. In one or more embodiments, a processing chamber applicable for use in semiconductor manufacturing includes a chamber body at least partially defining a processing volume, and a plasma source operable to flow a plasma to the processing volume. The processing chamber includes a substrate support disposed in the processing volume, and one or more light-emitting diodes (LEDs) operable to heat the processing volume.


