UV LED Encapsulation Using Si-O Polymer to Eliminate Air Gaps
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Solution Overview
Problem
Current ultraviolet LED devices face low light output efficiency due to air gaps and poor UV resistance of silicone resin encapsulation, leading to reduced service life and inconsistent light emission.
Innovation Solution
An ultraviolet LED device design featuring a holder with through holes for backfilling a Si—O main chain polymer, a protective fluororesin layer, and a silver paste sealing member to enhance light output and durability, along with a method for preparing the device that includes drilling through holes and filling with silicone oil to ensure complete air discharge and sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air or vacuum is used to fill the space between chip and quartz glass, then the encapsulation structure is simple, but light output efficiency is low due to UV energy loss
Solution Approach 1:
The patent changes the filling medium from air/vacuum to Si-O main chain polymer, fundamentally altering the optical parameters of the encapsulation medium to improve UV light transmission efficiency while maintaining structural simplicity
Solution Approach 2:
The patent uses composite material structure combining Si-O main chain polymer with quartz glass and ceramic substrate, creating a multi-material encapsulation system that optimizes both light transmission and structural stability
2Power
If silicone resin is used to encapsulate the cupped ceramic substrate, then radiant power is greatly improved initially, but UV resistance is poor leading to cracking and discoloration
Solution Approach 1:
The patent changes the chemical composition parameters of the encapsulation material from silicone resin to Si-O main chain polymer, which has superior UV resistance properties while maintaining good light transmission characteristics
Solution Approach 2:
The patent replaces the short-lived silicone resin encapsulation with a more durable Si-O main chain polymer that resists UV degradation, effectively extending the service life of the ultraviolet LED device
3Device complexity
If the chip is directly exposed to the encapsulation medium, then the structure is simple, but the chip is vulnerable to damage from polymer contact and UV irradiation
Solution Approach 1:
The patent introduces a protective layer as an intermediary between the chip and the Si-O main chain polymer encapsulation medium, protecting the chip from direct contact with the polymer and UV irradiation while allowing light transmission
Solution Approach 2:
The patent uses a thin film protective layer that is transparent to UV light, providing chip protection without significantly impeding light output, effectively balancing protection and optical performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves light output efficiency and extends the service life of the LED device by ensuring consistent light emission and maintaining structural stability under UV irradiation, while simplifying production and enhancing heat dissipation.
Implementation Method 1
the accommodation cavity is filled with a silicon-oxygen (Si—O) main chain polymer
Implementation Method 2
one side of the chip facing the lens is provided with a protective layer, and the protective layer is configured to isolate the chip from the Si—O main chain polymer
Implementation Method 3
a sealing member is disposed in each of the at least one through hole
Data Source
AI summary
An ultraviolet LED device includes a holder and a lens. The holder is provided with an accommodation cavity. The lens is configured to seal the accommodation cavity. A chip is disposed at a cavity bottom of the accommodation cavity. The accommodation cavity is filled with a Si—O main chain polymer. The holder is provided with at least one through hole. The at least one through hole is located at the bottom of the holder and communicates with the accommodation cavity. A sealing member is disposed in each of the at least one through hole.