UV LED Irradiation Layout for Uniform Substrate Debonding
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Solution Overview
Problem
Existing methods for separating a glass substrate from a semiconductor wafer during semiconductor device fabrication are inefficient, power-intensive, and result in low yields due to non-uniform light irradiation and separation processes.
Innovation Solution
A light irradiation apparatus using a LED module with LEDs arranged in intersecting directions to irradiate UV radiation with wavelengths of 200-280 nm, facilitating uniform nitrogen production in the adhesion layer for easy substrate separation, combined with a debonding apparatus using a vacuum chuck for efficient separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by stationary object
If conventional light sources are used for substrate separation, then separation can be achieved, but power consumption is high and heat generation is excessive
Solution Approach 1:
The patent changes the fundamental parameters of the light source by using LEDs with wavelengths of 200-280nm instead of conventional light sources. This parameter change enables efficient nitrogen production in the adhesion layer while consuming less power and generating minimal heat, directly resolving the contradiction between achieving separation and reducing power/heat.
Solution Approach 2:
The patent replaces conventional mechanical or thermal separation methods with a photochemical approach using LED irradiation. The UV light from LEDs induces nitrogen gas generation in the adhesion layer, creating a natural separation mechanism that eliminates the need for high-power heating or mechanical force, thereby reducing both power consumption and heat generation.
2Productivity
If conventional light irradiation methods are used, then substrate separation can be performed, but the process time is extended and yields are reduced due to non-uniform irradiation
Solution Approach 1:
The patent segments the light irradiation system into multiple LED modules arranged in intersecting directions (first and second directions). This segmentation allows uniform irradiation across the entire substrate surface from multiple angles, ensuring consistent nitrogen production throughout the adhesion layer and enabling faster, more reliable separation without extending process time.
Solution Approach 2:
The patent introduces a dimensional aspect to the irradiation system by arranging LEDs in intersecting directions rather than a single plane. This multi-dimensional arrangement ensures that light reaches all areas of the substrate uniformly, eliminating shadow effects and non-uniform irradiation, thereby reducing process time and improving yields.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces power consumption, minimizes heat generation, and enhances process efficiency by uniformly producing nitrogen across the adhesion layer, leading to improved yield and reduced process time.
Implementation Method 1
a light emitting diode (LED) module spaced apart from the stage, wherein the light emitting diode (LED) module includes a plurality of light emitting diodes (LEDs)
Implementation Method 2
allowing a light emitting diode (LED) module of the light irradiation apparatus to irradiate ultraviolet (UV) radiation to the substrate assembly
Data Source
AI summary
A light irradiation apparatus including a stage configured to support a substrate; and a light emitting diode (LED) module spaced apart from the stage, wherein the LED module includes a plurality of LEDs, wherein some of the plurality of LEDs are arranged in a first direction, and wherein others of the plurality of LEDs are provided in a second direction, the second direction intersecting the first direction.