Sealed Cover Structure for UV Light Source Oxygen Control
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Solution Overview
Problem
The existing ultraviolet light-based separation process for semiconductor chips is hindered by oxygen in the lifting space, which prevents the ultraviolet tape from hardening, leading to incomplete separation of chips from the tape, resulting in distorted edges and increased breakage during the packaging process.
Innovation Solution
A cover structure combined with an ultraviolet light source creates a sealed inner space with controlled oxygen levels, using an oxygen discharger to reduce oxygen concentration and facilitate the hardening of the ultraviolet tape, ensuring complete separation of chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ultraviolet light is emitted to illuminate the rear portion of the wafer to loosen the attachment between the separated chips and the ultraviolet tape, then the chips should be separated from the tape, but the oxygen in the lifting space obstructs or prevents the hardening of the ultraviolet tape, leading to insufficient separation at the edge portions
Solution Approach 1:
The patent introduces a cover structure that creates a sealed environment around the ultraviolet light source and wafer. This cover structure excludes oxygen from the illumination path, providing an inert atmosphere that allows the ultraviolet tape to harden properly when exposed to ultraviolet light, thereby enabling complete separation of chips from the tape at all portions including edge portions
2Ease of operation
If more external force is applied to pick up the chips from the separated wafer due to insufficient separation, then the chips can be removed from the wafer, but the chips are frequently broken as a result of the additional external force
Solution Approach 1:
The patent applies preliminary action by creating a sealed cover structure and removing oxygen before the ultraviolet light illumination process. This preliminary preparation ensures that the ultraviolet tape hardens completely and uniformly, including at the edge portions, so that chips separate cleanly from the tape without requiring additional external force during the pickup process, thereby preventing chip breakage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces chip detachment failures by creating a low-oxygen environment, allowing for precise and efficient separation of chips from the adhesive, thereby minimizing breakage and improving the packaging process.
Implementation Method 1
an oxygen discharger that creates a low-oxygen state in the closed space by discharging oxygen from the closed space
Implementation Method 2
ultraviolet light is emitted and illuminates the rear portion of the wafer to loosen the attachment between the separated chips and the ultraviolet tape
Data Source
AI summary
A cover structure for a light source includes a frame having an inner space, a driver, and an oxygen discharger. The frame is combined with the light source such that an object disposed in the inner space is covered by the frame, and the inner space is sealed by the combined frame and light source to provide a closed space between the frame and the light source enclosing the object. The driver combines the frame and the light source by moving the frame toward the light source such that the frame contacts the light source. The oxygen discharger creates a low-oxygen state in the closed space by discharging oxygen from the closed space.