UV Light-Emitting Device Package with High Reflectance Metal Substrate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light-emitting-device packages struggle to optimize reflectance for ultraviolet (UV) light emission efficiency, as current materials and structures do not effectively enhance UV reflectance.
Innovation Solution
A light-emitting-device package is designed with a metal substrate having high UV reflectance, paired with an insulating layer and electrodes, where the metal substrate's UV reflectance is higher than that of the electrodes, and the substrate includes aluminum with an aluminum oxide insulating layer, ensuring 70% or more of the light-emitting surface is exposed to enhance UV light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional materials and structures are used in light-emitting-device packages, then manufacturing is simpler, but UV light reflectance is insufficient
Solution Approach 1:
The patent employs composite material structures including metal substrates with specific surface treatments, transparent encapsulants with optimized compositions, and reflective coatings. These composite materials work together to achieve high UV reflectance (85% or more) while maintaining package integrity and managing thermal properties, resolving the contradiction between improved illumination and increased complexity.
Solution Approach 2:
The patent optimizes specific parameters such as the refractive index of encapsulants, surface roughness of metal substrates, and thickness of reflective layers to maximize UV reflectance. By carefully controlling these parameters within specific ranges, the package achieves superior UV light emission efficiency without requiring overly complex structural modifications.
2Productivity
If more of the light-emitting surface is exposed to enhance UV reflection, then UV emission efficiency improves, but protection of the light emitting device decreases
Solution Approach 1:
The patent utilizes transparent encapsulants as thin film structures that provide protective coverage while maintaining optical transparency. These encapsulants are designed to protect the light emitting device from environmental factors while allowing maximum UV light transmission and reflection, thus protecting the device without compromising emission efficiency.
Solution Approach 2:
The patent introduces intermediate structures such as reflective layers and optimized encapsulant materials that act as mediators between the light emitting device and the external environment. These intermediaries protect the device from direct exposure to harmful conditions while facilitating efficient UV light reflection and emission, resolving the contradiction between protection and efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The package significantly improves UV light emission efficiency by maximizing the exposure of high-reflectance aluminum surfaces, leading to enhanced UV light reflection and re-reflection, thereby increasing overall emission efficiency.
Implementation Method 1
the insulating layer may include an aluminum oxide formed by anodizing the aluminum of the metal substrate
Implementation Method 2
Ultraviolet reflectance of the first surface of the metal body is higher than ultraviolet reflectance of the pair of electrodes... reflectance of the metal substrate with respect to ultraviolet light in a wavelength range from 200 nm to 380 nm may be 85% or more but less than 100%
Data Source
AI summary
A light-emitting-device package according to one aspect of the present invention includes: a metal substrate; a light emitting device disposed on a first surface of the metal substrate and configured to emit at least ultraviolet light; a pair of electrodes disposed to be spaced apart from each other on at least the first surface of the metal substrate, and electrically connected to the light emitting device; and an insulating layer provided between the metal substrate and the pair of electrodes. UV reflectance of the first surface of the metal body is higher than UV reflectance of the pair of electrodes.


