Laminated Substrate Heat Transfer Members for UV Light Irradiation
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Solution Overview
Problem
Existing UV light irradiation devices face challenges in effectively radiating heat generated by high-intensity light emitting elements, leading to reduced illuminance and variability in light emission, especially when a large number of elements are mounted on a substrate.
Innovation Solution
A light irradiation device with a laminated substrate structure incorporating a high thermal conductivity first heat transfer member beneath the light emitting elements and a second heat transfer member surrounding the first, along with electrical wiring for efficient heat dissipation, ensuring reliable heat radiation and consistent illuminance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the number of light emitting elements is increased to improve illuminance intensity, then the heat generation increases and heat radiation becomes more difficult
Solution Approach 1:
The heat transfer member is divided into multiple segments (first heat transfer member and second heat transfer member) that are arranged in a specific pattern. This segmentation allows heat to be distributed and transferred from multiple light emitting elements simultaneously, improving overall heat radiation efficiency while maintaining high illuminance intensity from multiple elements.
Solution Approach 2:
The heat transfer member acts as an intermediary between the light emitting elements and the heat radiation member. It receives heat from multiple light emitting elements and transfers it to the heat radiation member, enabling effective heat management while maintaining high illuminance output from multiple elements.
2Temperature
If a heat radiation member is provided to radiate heat from light emitting elements, then heat radiation is improved, but the structure becomes more complex
Solution Approach 1:
The heat transfer member and the substrate are merged into a single integrated structure. The heat transfer member is formed as part of the substrate itself, eliminating the need for separate heat radiation members and reducing overall structural complexity while maintaining effective heat radiation.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for the light emitting elements and simultaneously acts as a heat transfer member for radiation. This multi-functionality eliminates the need for dedicated heat radiation structures, simplifying the overall device design.
3Temperature
If heat transfer members are added to improve heat radiation, then heat dissipation is enhanced, but manufacturing complexity increases
Solution Approach 1:
The heat transfer members are formed during the substrate manufacturing process itself, before the light emitting elements are mounted. This preliminary formation of heat transfer structures simplifies subsequent assembly steps and reduces overall manufacturing complexity while ensuring effective heat dissipation.
Solution Approach 2:
The thermal conductivity parameter of the substrate is enhanced by incorporating heat transfer members with higher thermal conductivity than the base substrate material. This parameter change improves heat dissipation capability while the manufacturing process remains integrated and relatively simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively radiates heat from multiple light emitting elements, maintaining high illuminance intensity and reducing variability, even with increased element density, thereby enhancing the heat radiation properties and stability of the light irradiation device.
Implementation Method 1
Thermal conductivities of the first heat transfer member and second heat transfer member are higher than a thermal conductivity of the laminated body
Data Source
AI summary
A light irradiation device according to an embodiment includes a light emitting element, and a substrate on which the light emitting element is mounted. The substrate includes a laminated body constituted so that a plurality of insulating layers are laminated, a first heat transfer member disposed in the laminated body so that a part thereof is located directly below the light emitting element, and a second heat transfer member disposed between the insulating layers so as to surround the first heat transfer member when seen in a plan view. Thermal conductivities of the first heat transfer member and second heat transfer member are higher than a thermal conductivity of the laminated body.