Patterned Nanoparticle Structures Using UV Molded Nanoimprinting

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Solution Overview

Problem

Current manufacturing techniques for semiconductors with opto-electronic properties are limited by subtractive processes that are expensive, wasteful, and unable to efficiently produce patterned structures at sub-micron lengths, particularly for semi-crystalline and conducting compositions.

Innovation Solution

The development of patterned nanostructures using nanoparticles with average sizes below 100 nm, formed through additive processes involving electromagnetic radiation and patterned molds or masks, allowing for the creation of features smaller than 5 microns, including three-dimensional structures with minimal volume contraction during calcination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional subtractive manufacturing processes are used, then material can be built up and removed through mask/etch processes, but the process becomes expensive, wasteful, and unable to efficiently produce patterned structures at sub-micron lengths

Engineering Contradiction:
Improvepatterned structure dimensionsVSAvoidmanufacturing efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent inverts the traditional subtractive manufacturing approach by using additive manufacturing. Instead of building up material and removing it through mask/etch processes, the invention directly deposits nanoparticles in desired patterns using electromagnetic radiation and patterned molds, achieving sub-micron precision without the waste and complexity of subtractive processes

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The patent replaces mechanical mask/etch processes with electromagnetic radiation-based nanoparticle manipulation. Electromagnetic radiation is used to manipulate and deposit nanoparticles according to patterned molds, eliminating the need for physical masks and etching machinery while achieving superior sub-micron patterning precision

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If direct write techniques are used to produce patterns by precipitation and coagulation of inks, then additive manufacturing is achieved, but the process is slow, limited to large micron scale dimensions, and not easily scalable

Engineering Contradiction:
Improveadditive manufacturing capabilityVSAvoidmanufacturing speed
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent changes the fundamental parameters of the manufacturing process by using nanoparticles with average sizes below 100 nm instead of traditional ink formulations. This enables high-speed manufacturing through electromagnetic radiation processing while achieving sub-micron feature sizes, overcoming the speed and scalability limitations of conventional direct write techniques

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent transitions from conventional two-dimensional planar manufacturing to three-dimensional nanoparticle structure formation. By manipulating nanoparticles in three-dimensional space using electromagnetic radiation and patterned molds, the process achieves both high speed and sub-micron precision while enabling scalable production of complex 3D nanostructures

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If traditional manufacturing techniques are used, then materials can be processed, but the types of materials are limited and semi-crystalline, crystalline or conducting compositions cannot be manipulated at low temperature

Engineering Contradiction:
Improvematerial compatibilityVSAvoidprocessing temperature
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent changes the processing parameters by using electromagnetic radiation to manipulate nanoparticles at low temperatures. This enables the processing of semi-crystalline, crystalline, and conducting compositions that cannot be handled by traditional high-temperature methods, significantly expanding material compatibility while maintaining control over material properties

Inventive Principle:
Principle #35Parameter changes

4Manufacturing precision

If nanoparticle composition is applied and manipulated using electromagnetic radiation with patterned mold, then patterned nanostructures with feature size below 5 microns are formed, but the process complexity increases

Engineering Contradiction:
Improvefeature sizeVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent introduces patterned molds as intermediaries that simplify the complex task of sub-micron patterning. The molds serve as templates that guide nanoparticle deposition, enabling precise feature sizes below 5 microns without requiring complex direct manipulation methods. The mold acts as a mediator between the electromagnetic radiation system and the final nanopatterned structure

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the fabrication of nanostructures with tunable optoelectronic properties, reduced shrinkage, and scalable high-speed manufacturing, overcoming the limitations of traditional techniques by producing precise, efficient, and cost-effective patterned nanostructures.

Implementation Method 1

using electromagnetic radiation in cooperation with a patterned mold and/or mask to manipulate the nanoparticle composition and form the patterned nanostructure

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Data Source

PatentUS11961628B2Patterned nanoparticle structures
Publication Date: 2024.04.16 UNIV OF MASSACHUSETTS
  • US11961628B2 patent drawing
  • US11961628B2 patent drawing
  • US11961628B2 patent drawing

AI summary

Aspects relate to patterned nanostructures having a feature size not including film thickness of below 5 microns. The patterned nanostructures are made up of nanoparticles having an average particle size of less than 100 nm. A nanoparticle composition, which, in some cases, includes a binder, is applied to a substrate. A patterned mold used in concert with electromagnetic radiation function to manipulate the nanoparticle composition in forming the patterned nanostructure. In some embodiments, the patterned mold nanoimprints a pattern onto the nanoparticle composition and the composition is cured through UV or thermal energy. Three-dimensional patterned nanostructures may be formed. A number of patterned nanostructure layers may be prepared and joined together. In some cases, a patterned nanostructure may be formed as a layer that is releasable from the substrate upon which it is initially formed. Such releasable layers may be arranged to form a three-dimensional patterned nanostructure for suitable applications.