UV Curing Paste Shrinkage Monitoring via Laser Displacement

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Solution Overview

Problem

Current methods for monitoring and measuring paste shrinkage in the Z direction during UV curing, such as ISO 352 and ASTM D2566-79 standards, are inadequate due to heterogeneous curing and resin out-gas issues, leading to inaccurate data and noise interference in real applications, especially for UV curable adhesive pastes.

Innovation Solution

A machine and method for timely monitoring paste shrinkage in the Z direction during UV curing, which includes a rotatable platform, laser displacement sensor, and precise alignment features to measure thickness changes over time, allowing for the calculation of change rates after various processes like UV curing, thermal curing, and reliability testing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If standard ISO 352 or ASTM D2566-79 methods are used to measure paste shrinkage, then volume and linear shrinkage can be measured, but measurement precision deteriorates due to heterogeneous curing and resin out-gas during UV curing process

Engineering Contradiction:
Improvepaste shrinkage measurement accuracyVSAvoidmeasurement reliability under UV curing conditions
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent introduces an intermediary measurement system that uses optical fields (laser displacement sensor) to measure paste thickness changes during UV curing. This intermediary approach avoids direct contact with the curing paste, eliminating the harmful effects of heterogeneous curing and resin out-gas on measurement accuracy while maintaining reliable data collection throughout the curing process

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces traditional mechanical measurement methods (Vernier Caliper, 3D Laser Confocal) with a non-contact optical measurement system. The laser displacement sensor measures paste thickness changes through optical fields, substituting mechanical contact that would be affected by curing heterogeneity and resin out-gas, thereby achieving both high precision and reliability

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If Vernier Caliper or 3D Laser Confocal is used to measure paste dimension before and after curing, then dimension changes can be detected, but measurement precision deteriorates due to noise at measuring position

Engineering Contradiction:
Improvedimension measurement accuracyVSAvoidnoise interference during measurement
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent implements continuous real-time measurement of paste thickness during the entire UV curing process using a laser displacement sensor. This continuous measurement approach captures the dynamic shrinkage process without interruption, eliminating the need for separate pre-curing and post-curing measurements that are susceptible to noise interference at discrete measuring positions

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The laser displacement sensor acts as an intermediary measurement device that collects data through optical fields without physical contact with the paste. This intermediary approach avoids the noise problems associated with mechanical contact methods while maintaining high measurement precision throughout the curing process

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If cylinder method is used to solve heterogeneous curing issue, then UV curable adhesive paste can be measured, but measurement precision deteriorates due to heterogeneous cavity generation

Engineering Contradiction:
Improveapplicability to UV curable adhesive pasteVSAvoiddata accuracy
Core Design Contradiction:
Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The patent replaces mechanical measurement methods that create heterogeneous cavities with a non-contact optical measurement system. The laser displacement sensor measures paste surface position through optical fields without physical interaction, eliminating cavity generation while maintaining applicability to UV curable adhesive paste and achieving high measurement precision

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The optical measurement system serves as an intermediary that bridges the gap between measurement needs and UV curing conditions without introducing harmful effects. This intermediary approach enables accurate measurement of UV curable adhesive paste shrinkage while avoiding the heterogeneous cavity problem inherent in mechanical methods

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate and precise monitoring of paste shrinkage trends and change rates in the Z direction, effectively addressing the limitations of existing methods by reducing noise interference and providing insights into UV curing kinetics and adhesive performance in camera applications.

Implementation Method 1

a laser displacement sensor is disposed above the rotatable platform and configured for measuring a thickness of the paste

Methodology Applied
Scientific EffectLaser: Laser

Implementation Method 2

measuring a thickness of the paste at one point over UV applied time at predetermined time intervals

Methodology Applied
Scientific EffectOptical measurement:

Data Source

PatentUS20230417539A1Machine of paste shrinkage and expansion in z direction
Publication Date: 2023.12.28 HENKEL KGAA
  • US20230417539A1 patent drawing
  • US20230417539A1 patent drawing
  • US20230417539A1 patent drawing

AI summary

The disclosed provides a machine of paste shrinkage and expansion for timely monitoring a paste shrinkage in a Z direction during a UV curing process and for obtaining a change rate of a paste in a Z direction after a certain process. The machine comprises: a bottom substrate; a top substrate which is transparent and configured to be placed on the paste so that the paste is sandwiched between a top surface of the bottom substrate and a bottom surface of the top substrate, wherein the top surface of the bottom substrate and the bottom surface of the top substrate are provided with first and second reflecting layers, respectively, and define a thickness of the paste; a platform for supporting the bottom substrate; a plurality of pressing clamps configured for securing the bottom substrate on the platform in the Z direction; a plurality of pushing clamps configured for securing the bottom substrate in radial and circumferential directions; a plurality of UV sources positioned uniformly around the paste; and a sensor configured for measuring the thickness of the paste. The bottom substrate and the platform comprise a substrate dial and a platform dial, respectively, and the bottom substrate has a profile consistent with the platform dial. The disclosed provides methods for timely monitoring a paste shrinkage in a Z direction during a UV curing process and for obtaining a change rate of a paste in a Z direction after a certain process.