UV Patterning Handle Layer for Selective LED Assembly
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Solution Overview
Problem
Current methods are unable to efficiently scale down the assembly of individually switchable standard LEDs for smaller displays, such as those in portable devices, due to inefficiencies in light direction control and the feasibility of assembling millions of pixels using standard manufacturing techniques.
Innovation Solution
A manufacturing assembly method for inorganic LED displays involves patterning a handle layer with UV light to selectively reduce adhesion between LEDs and the layer, allowing for the use of a pick-up tool to selectively pick and place LEDs in a micro-assembly process, enabling the assembly of millions of inorganic LED dies in a matrix array.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If standard assembly manufacturing techniques are used to assemble millions of pixels, then the display can be manufactured, but the assembly process becomes infeasible and inefficient
Solution Approach 1:
The patent segments the handle layer into multiple sections, with each section containing a specific array of LEDs. This segmentation allows the pick-up tool to selectively pick LEDs from specific sections rather than handling the entire array, significantly improving assembly efficiency and making the manufacturing process feasible for millions of pixels
Solution Approach 2:
The patent applies a handle layer to the LED array beforehand, which enables subsequent selective picking operations. This preliminary action of attaching the handle layer facilitates the entire pick-and-place assembly process, making it possible to efficiently assemble millions of LEDs that would otherwise be infeasible to manufacture
2Illumination intensity
If standard LEDs are used for smaller displays, then the display can be assembled, but light direction control becomes inefficient
Solution Approach 1:
The patent segments the LED array into multiple sections, with each section optimized for specific light direction control requirements. This local quality approach allows different sections to have tailored optical characteristics, improving overall light direction control efficiency for smaller display applications
3Productivity
If all LEDs on a handle layer are picked simultaneously, then the transfer is efficient, but defective LEDs cannot be removed selectively
Solution Approach 1:
The patent divides the handle layer into multiple sections, each containing specific arrays of LEDs. This segmentation enables the pick-up tool to selectively pick LEDs from individual sections, allowing defective LEDs to be identified and removed selectively while maintaining efficient transfer of good LEDs
Solution Approach 2:
The patent enables dynamic control of the picking process by allowing selective picking of different sections based on LED quality. This dynamic approach permits the system to adapt to defective LEDs by adjusting which sections are picked, thereby improving reliability while maintaining transfer efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the efficient assembly of high-brightness, directional LED displays by enabling the selective picking and placement of LEDs, reducing power consumption and enhancing luminance, thereby extending battery life and improving display brightness in portable devices.
Implementation Method 1
The handle layer may UV tape. The UV tape is selectively irradiated (patterned) with a UV light only below the LEDs (this is termed a corresponding section of the handle layer, in that it corresponds to the location of an LED device) which need to be picked. The adhesion between these LEDs and the tape is decreased
Data Source
AI summary
Methods and apparatus for use in the manufacture of a display element. Some embodiments include a method for selective pick up of a subset of a plurality of electronic devices adhered to a handle layer. The method comprises modifying a level of adhesion between one or more electronic devices of the plurality of electronic devices adhered to the handle layer, such that the subset of the plurality of electronic devices has a level of adhesion to the handle layer that is less than a force applied by a pick up tool, PUT. This enables selective pick up of the subset of the plurality of electronic devices from the handle layer by the PUT.