UV-Curable PCB Assembly Fixing for Precise Component Placement
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Solution Overview
Problem
Existing pick and place mounting processes for electronic components on printed circuit boards face challenges in accurately positioning both larger and smaller, flexible parts, leading to precision issues and increased thermal stress during the mounting process.
Innovation Solution
A method involving the use of UV curable substances applied to a substrate, where an electrically conductive item is positioned on the substrate and exposed to UV irradiation, forming a mechanical connection, thereby improving the accuracy and stability of component placement without the need for thermal curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If wet solder paste or small blobs of adhesive are used to temporarily adhere larger components to the PCB, then the components are secured in position during assembly, but the glue must be burnt and decomposed during thermal curing which increases thermal stress and process complexity
Solution Approach 1:
The patent extracts the temporary positioning function from the thermal curing process by using UV-curable adhesive that sets at room temperature. The UV adhesive is applied to the PCB contact area, and the component is positioned and fixed without requiring subsequent thermal decomposition, thereby eliminating the harmful thermal stress and simplifying the mounting process.
Solution Approach 2:
The patent employs a disposable UV-curable adhesive that performs its positioning function and then remains as a stable bond without needing to be removed or decomposed. This eliminates the complex thermal curing process required for traditional solder paste or heat-activated adhesives, reducing both process complexity and thermal stress on components.
2Strength
If traditional thermal curing methods are used to fixate components, then strong mechanical bonds are formed, but thermal stress is generated during the curing process which can damage sensitive electronic parts
Solution Approach 1:
The patent replaces the thermal curing mechanism with a UV光固化 mechanism. The UV-curable adhesive is activated by exposure to UV light rather than heat, forming a strong mechanical bond without generating thermal stress. This substitution of the curing mechanism eliminates the harmful thermal effects while maintaining bond strength.
Solution Approach 2:
The patent changes the curing parameter from thermal energy to UV light energy. By using UV-curable adhesive that polymerizes upon UV exposure, the process achieves strong bonding without the high temperatures associated with thermal curing, thereby protecting sensitive electronic components from thermal damage.
3Weight of moving object
If miniaturization of circuitry is pursued, then smaller and lighter electronic parts are used, but accurate positioning becomes more difficult and precision is reduced
Solution Approach 1:
The patent applies UV-curable adhesive to the PCB contact area before component placement. The adhesive is cured with UV light immediately before or during component positioning, creating a stable bonding surface that holds small, lightweight components in precise positions. This preliminary bonding action prevents positioning drift that would occur with traditional methods.
Solution Approach 2:
The patent uses UV light activation instead of thermal processes to cure the adhesive. This allows for precise positioning of small components without the thermal expansion and contraction that would compromise positioning accuracy, enabling better control over component placement precision in miniaturized circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the accuracy and mechanical stability of electronic component placement, reduces thermal stress, and simplifies the mounting process, leading to higher throughput and improved packing density with reduced misplacement of components.
Implementation Method 1
Exposing the UV curable substance to UV irradiation, wherein a mechanical connection between the electrically conductive item and substrate is formed
Data Source
AI summary
One aspect relates to a method of manufacture of an electronic assembly comprising at least these steps: providing a substrate having at least a first contact area; positioning a spot of a UV curable substance on the substrate; positioning an electrically conductive item on the substrate wherein the electrically conductive item is superimposed on the first contact area and on the spot of curable substance; exposing the UV curable substance to UV irradiation, wherein a mechanical connection between the electrically conductive item and substrate is formed; and optionally connecting the first contact area with the electrically conductive item. One aspect relates to an electronic assembly comprising a substrate with a contact area, a spot of a cured substance on the substrate and an electrically conductive item that is in electrically conductive connection with the first contact area and mechanically connected through the spot of cured substance to the substrate.