UV-Activated Peel-Off Layer for Semiconductor Substrate Separation
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Solution Overview
Problem
The existing methods for manufacturing semiconductor devices with through silicon via (TSV) structures face challenges in preventing position deviation and efficient separation from support substrates, as traditional adhesive layers can be dissolved by solvents or require manual removal, leading to reduced productivity and potential damage to the semiconductor substrate.
Innovation Solution
A method involving a peel-off layer and an adhesive layer with a tape having an adhesive agent whose strength is reduced by UV irradiation, allowing for controlled separation of the semiconductor substrate from the support substrate by forming a ring-shaped cured portion with lowered adhesive strength, facilitating efficient peeling without damaging the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the adhesion layer directly contacts the semiconductor substrate in the peripheral portion to prevent position deviation, then position stability is improved, but separation difficulty increases
Solution Approach 1:
The adhesive structure is segmented into two distinct layers: an adhesion layer for bonding and a peel-off layer for separation. The peel-off layer is selectively removed from the peripheral portion, creating a segmented adhesive structure that provides different functions in different regions - strong adhesion in the central area for position stability and easy separation in the peripheral area for manufacturing ease
Solution Approach 2:
The peel-off layer is extracted or removed from the peripheral portion of the adhesive structure. This selective removal creates a region where the adhesion layer directly contacts the semiconductor substrate, enabling easy separation in the peripheral area while maintaining the complete adhesive structure in the central area for position stability
2Ease of manufacture
If the liquid solvent is used to dissolve the adhesion layer for separation, then separation ease is improved, but substrate detachment risk increases
Solution Approach 1:
The peel-off layer serves as an intermediary between the adhesion layer and the semiconductor substrate. By selectively removing this intermediary layer in the peripheral portion, the adhesion layer can directly contact the substrate for strong bonding in the central area while allowing controlled separation in the peripheral area without requiring solvents that could cause substrate detachment
3Reliability
If the adhesion layer tolerance to liquid solvent is increased, then substrate detachment risk is reduced, but dissolution rate decreases
Solution Approach 1:
Instead of modifying the adhesion layer's chemical properties, the peel-off layer is extracted from the peripheral portion. This physical removal approach maintains the adhesion layer's original dissolution rate and productivity benefits while eliminating the need for solvent application that could cause substrate detachment, achieving reliability improvement without sacrificing productivity
4Ease of manufacture
If direct removal with blade is used to remove the adhesion layer, then separation effectiveness is improved, but effective area reduction occurs
Solution Approach 1:
The adhesive structure is segmented such that the peel-off layer is removed only from the peripheral portion while remaining intact in the central area. This segmentation allows effective separation in the peripheral region without affecting the effective bonding area in the central region, maintaining both separation effectiveness and effective area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise and efficient separation of the semiconductor substrate from the support substrate, minimizing position deviation and maintaining substrate integrity, thereby improving productivity and reducing the risk of cracking during the separation process.
Implementation Method 1
irradiating a portion of the adhesive agent provided at the outer peripheral portion with UV rays directed toward the first surface
Data Source
AI summary
A method of manufacturing a semiconductor device includes disposing a peel-off layer on the second surface of the first substrate, wherein the second surface of the first substrate comprises semiconductor integrated circuits, and the peel-off layer does not extend to an outer peripheral portion of the first substrate, bonding a second substrate to the peel-off layer via a bonding layer, attaching a tape onto the first surface of the first substrate, wherein the tape comprises an adhesive agent having an adhesive strength capable of being lowered by UV irradiation, irradiating a portion of the adhesive agent provided at the outer peripheral portion with UV rays directed toward the first surface, and separating the first substrate from the second substrate at the adhesive agent portion and the peel-off layer portion.