Resin Lamination via UV Plasma Surface Activation
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Solution Overview
Problem
Conventional lamination processes for microchips, whether using adhesives or heat sealing, often result in inadequate bonding strength and non-uniform microchannel diameters, which hinder the achievement of high functional capabilities in micro total analysis systems (μTAS).
Innovation Solution
The process involves surface activation of laminating surfaces with vacuum ultraviolet rays or atmospheric pressure plasma, terminating the treatment when the water contact angle reaches a specific initial drop range, followed by bonding methods such as heating or pressurizing the substrates to ensure high bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the treatment with vacuum ultraviolet ray or atmospheric pressure plasma is excessive, then the bonding strength of laminates is reduced
Solution Approach 1:
The patent applies partial action by terminating the plasma or UV treatment when the water contact angle reaches a specific range (20-40 degrees), rather than continuing treatment until complete hydrophilization. This partial treatment achieves sufficient surface activation for bonding without excessive treatment that would cause polymer disintegration and reduce bonding strength.
Solution Approach 2:
The patent uses water contact angle measurement as a feedback parameter to monitor the surface treatment process in real-time. By measuring the contact angle during treatment and comparing it to the target range, the process can be dynamically adjusted to achieve optimal bonding strength while avoiding over-treatment.
2Strength
If adhesive is used for lamination, then bonding between substrates is achieved, but adhesive exudes into microchannels causing clogging and non-uniform diameter
Solution Approach 1:
The patent extracts and eliminates the adhesive from the lamination process entirely. Instead of using adhesive bonding, it employs direct substrate-to-substrate bonding achieved through surface activation with plasma or UV treatment, followed by thermal or pressure bonding. This removes the source of contamination that would otherwise exude into microchannels.
Solution Approach 2:
The patent introduces surface activation treatment (plasma or UV) as an intermediary step that prepares the substrate surfaces for direct bonding. This intermediary process creates reactive groups on the surface that enable strong adhesion without requiring additional adhesive materials, thus preventing contamination of the microchannel system.
3Strength
If heat sealing is used for lamination, then bonding is achieved, but channels are crushed during heating causing loss of cross-sectional shape
Solution Approach 1:
The patent changes the bonding parameters by using lower temperatures combined with pressure, or controlled heating within a safe range that prevents channel deformation. The surface activation treatment enables bonding to occur at milder conditions than conventional heat sealing, preserving the microchannel geometry while achieving strong bonds.
Solution Approach 2:
The patent performs surface activation treatment beforehand to prepare the bonding surfaces, which enables subsequent bonding to proceed under milder conditions. This preliminary action creates surface energy and reactive groups that facilitate bonding at lower temperatures or with controlled pressure, avoiding the high-temperature crushing that would deform the channels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures high bonding strength in the laminates, preventing polymer disintegration and maintaining the microchannel's predetermined shape, thus enhancing the functional capabilities of microchips.
Implementation Method 1
a surface activation step of treating a laminating surface of the first work and a laminating surface of the second work with vacuum ultraviolet ray or with atmospheric pressure plasma
Implementation Method 2
a surface activation step of treating a laminating surface of the first work and a laminating surface of the second work with vacuum ultraviolet ray or with atmospheric pressure plasma
Implementation Method 3
the application of vacuum ultraviolet ray onto the surface of the substrates thereby activating the surface of the substrates
Implementation Method 4
a bonding step of bonding the first work to the second work stacked on each other such that the laminating surface of the first work abuts the laminating surface of the second work, the bonding carried out by any one of methods (1) to (4) below, (1): a method of heating the first work and the second work
Implementation Method 5
a bonding step of bonding the first work to the second work stacked on each other such that the laminating surface of the first work abuts the laminating surface of the second work, the bonding carried out by any one of methods (1) to (4) below, (2) a method of pressurizing the first work and the second work in the direction of thickness of the works
Data Source
AI summary
An object of the present invention is to provide a process for laminating works together that are capable of giving laminates a high bonding strength ensured therein. The process for laminating works together laminates a work composed of a resin to a work composed of a resin or glass, the process including a surface activation step of treating a laminating surface of at least the work composed of a resin with vacuum ultraviolet ray or with atmospheric pressure plasma, and a bonding step of bonding together the two works stacked on each other such that a laminating surface of one of the works abuts a laminating surface of the other work, wherein in the surface activation step, the treatment of the laminating surfaces with vacuum ultraviolet ray or with atmospheric pressure plasma is terminated when an accumulated treatment quantity of the vacuum ultraviolet ray or the atmospheric pressure plasma applied to the laminating surfaces is within an initial drop range shown in a variation curve of a water contact angle on the laminating surfaces with respect to the accumulated treatment quantity.