UV-Patternable Polymer Blends for Photoresist-Free OTFT Patterning

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Solution Overview

Problem

Traditional photolithography techniques for patterning organic semiconductor layers in organic thin-film transistors (OTFTs) involve harsh oxygen plasma and aggressive solvents, which damage the OSC layer and deteriorate device performance, making them impractical for OTFT manufacturing.

Innovation Solution

Development of UV patternable organic semiconductor/isolating polymer blends comprising a diketopyrrolopyrrole-fused thiophene polymeric material blended with a non-conjugated isolating polymer, photoinitiators, and crosslinkers, allowing for UV patterning without photoresists, using thiol-ene polymerizations and radical initiators to form high-resolution patterns in air.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional photolithography techniques are used for patterning organic semiconductor layers, then pattern transfer can be achieved, but harsh oxygen plasma and aggressive solvents damage the OSC layer and deteriorate device performance

Engineering Contradiction:
Improvepatterning precisionVSAvoiddamage to OSC layer
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent extracts and removes the harmful elements (oxygen plasma and aggressive solvents) from the patterning process by replacing them with a photoresist-free UV patterning method using organic semiconductor/isolating polymer blends, thereby eliminating damage to the OSC layer while maintaining patterning precision

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the chemical and physical parameters of the patterning process by using UV irradiation to induce crosslinking in the isolating polymer phase at room temperature or mild heating conditions, replacing the harsh plasma and solvent-based processes with a milder photopolymerization approach that preserves OSC layer integrity

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If photolithography with photoresist is used, then pattern transfer is achieved, but complex photolithographic patterning methods and harsh chemicals are required

Engineering Contradiction:
Improvepattern transferVSAvoidpatterning process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges the semiconductor layer and isolating polymer into a single blended layer that serves both as the functional semiconductor component and as the patterning medium, eliminating the need for separate photoresist application and processing steps

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The isolating polymer phase within the blend performs the patterning function itself through UV-induced crosslinking, making the system self-sufficient and eliminating the need for external photoresist materials and complex photolithography procedures

Inventive Principle:
Principle #25Self-service

3Loss of substance

If UV patterning without photoresist is implemented, then material costs and environmental impact are reduced, but the OSC layer stability must be maintained

Engineering Contradiction:
Improvematerial wasteVSAvoidOSC layer stability
Core Design Contradiction:
Loss of substanceVSStability of the object's composition

Solution Approach 1:

The patent creates a composite material system where the organic semiconductor polymer is blended with an isolating polymer containing crosslinkable functional groups, forming a heterogeneous structure where the isolating polymer provides UV-responsive crosslinking capability while the semiconductor phase maintains its functional integrity and stability

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent applies local quality by restricting UV-induced crosslinking to only the isolating polymer phase while leaving the organic semiconductor phase unchanged, thereby achieving patterning in the isolating polymer regions without affecting the stability and functionality of the OSC layer

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables efficient, high-resolution patterning of OTFTs in air, reducing material costs and environmental impact, while maintaining device performance by avoiding harsh chemicals and improving the stability of the OSC layer.

Implementation Method 1

at least one photoinitiator configured to generate active radicals

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Implementation Method 2

using thiol-ene polymerizations and radical initiators to form high-resolution patterns

Methodology Applied
Scientific EffectThiol-ene polymerization: Chemical Bonding

Data Source

PatentUS12048236B2UV patternable polymer blends for organic thin-film transistors
Publication Date: 2024.07.23 CORNING INC
  • US12048236B2 patent drawing
  • US12048236B2 patent drawing
  • US12048236B2 patent drawing

AI summary

A polymer blend includes an organic semiconductor polymer blended with an isolating polymer; at least one photoinitiator for generating active radicals; and at least one crosslinker comprising C═C bonds, thiols, or combinations thereof, such that the organic semiconductor polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, the fused thiophene is beta-substituted, and the isolating polymer has a non-conjugated backbone. A method of forming an organic semiconductor device having the polymer blend is also presented.