UV Release Tape for Semiconductor Wafer Fixation
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Solution Overview
Problem
Adhesive tapes used in semiconductor manufacturing, particularly in wafer back grinding and dicing, face issues with adhesive force degradation over time, softening of the UV release layer, and adhesive residue, necessitating improved material and structural design for effective wafer fixation and easy separation.
Innovation Solution
A UV release tape comprising a substrate layer made of polyvinyl chloride with added plasticizer and metal salt compounds, including calcium and zinc salts, and a UV release layer with specific adhesive composition, ensuring high initial peeling strength and significant reduction after UV exposure to prevent residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If UV adhesive tape is used to fix the wafer, then the adhesive force is stronger, but the UV release layer softens and leaves adhesive residue
Solution Approach 1:
The patent modifies the chemical composition parameters of the substrate layer by incorporating specific metal salt compounds (calcium salt 1-8 phr, zinc salt 1-8 phr) and plasticizers (20-65 phr) into the polyvinyl chloride matrix. These parameter changes enable the substrate layer to maintain dimensional stability and prevent UV release layer softening while preserving strong adhesive force.
Solution Approach 2:
The patent creates a composite substrate layer material system combining polyvinyl chloride with metal salt compounds (calcium stearate, zinc stearate) and plasticizers. This composite structure provides both strong adhesion and resistance to UV-induced softening, resolving the contradiction between adhesive strength and release layer stability.
2Strength
If adhesive tape is used for wafer fixation, then the wafer is securely fixed, but adhesive residue remains after separation
Solution Approach 1:
The patent divides the adhesive system into functionally distinct layers: a substrate layer providing structural support and adhesion, and a UV release layer providing controlled bonding. This segmentation allows the substrate layer to maintain strong fixation while the UV release layer enables clean separation without residue.
Solution Approach 2:
The patent replaces mechanical separation (which causes residue) with UV light-triggered chemical separation. The UV release layer undergoes photochemical changes upon UV exposure, reducing adhesion and enabling clean separation without adhesive residue.
3Ease of operation
If non-UV adhesive tape is used, then separation is easier, but the adhesive force is lower
Solution Approach 1:
The patent makes the adhesive properties dynamic through UV responsiveness. The UV release layer provides strong adhesion initially, then dynamically reduces adhesion strength upon UV exposure, enabling easy separation. This dynamic behavior combines the advantages of both strong bonding and easy separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The UV release tape maintains optimal peeling strength and prevents adhesive residue, facilitating easy separation from silicon wafers and other substrates, with improved long-term performance and convenience in semiconductor manufacturing processes.
Implementation Method 1
A peeling strength of the UV release layer toward a silicon wafer is greater than 10 N/in
Implementation Method 2
the adhesive composition includes: 20 phr to 60 phr of an acryl polymer, 2 phr to 20 phr of an acrylic polymer, 0.2 phr to 2 phr of a hardener, and 0.5 phr to 5 phr of a photoinitiator
Implementation Method 3
after being exposed to ultraviolet light, the peeling strength of the UV release layer toward the silicon wafer is less than 0.3 N/in
Data Source
AI summary
A UV release tape includes a substrate layer, a UV release layer, and a separation layer. The UV release layer is disposed between the substrate layer and the separation layer. A material of the substrate layer includes a polyvinyl chloride, a plasticizer, and a metal salt compound. Relative to 100 phr of the polyvinyl chloride, an amount of the metal salt compound ranges from 1 phr to 8 phr. The metal salt compound includes a calcium salt compound and a zinc salt compound. A peeling strength of the UV release layer toward a silicon wafer is higher than 10 N/in. After being exposed to UV light, the peeling strength of the UV release layer toward the silicon wafer is lower than 0.3 N/in.