UV-Removable Protective Sheet for Semiconductor Transport
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Solution Overview
Problem
Partially processed electronic parts, such as semiconductor devices, are vulnerable to physical damage and environmental contamination during transport due to lack of protection before final packaging, leading to time delays and financial burdens from defective units.
Innovation Solution
A method involving the application of a protective sheet on partially processed semiconductor devices, which can be transported and later removed using UV light, allowing for semiconductor processing operations before packaging, and potentially applying a second protective sheet post-processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If partially-processed semiconductor devices are transported without protective packaging to enable intermediate processing operations, then processing flexibility and productivity are improved, but the devices become vulnerable to physical damage and environmental contamination
Solution Approach 1:
The protective packaging is divided into a base tray that holds the semiconductor devices and a separate removable lid. This segmentation allows the lid to be removed for intermediate processing operations while the base tray continues to provide protection and support for the devices during transport and storage.
Solution Approach 2:
The semiconductor devices are placed in the protective base tray and secured with foam material before transport. This preliminary protective action ensures devices are protected during shipping, and the removable lid can be taken off at the destination to allow intermediate processing without requiring full repackaging.
2Reliability
If protective packaging is applied to partially-processed semiconductor devices before transport, then device protection is improved, but the complexity of packaging and unpackaging operations increases
Solution Approach 1:
The packaging system is segmented into a permanent base tray and a removable lid. The base tray with foam inserts provides structured protection that remains in place, while only the lid needs to be removed and reattached, significantly simplifying operations compared to complete packaging assembly and disassembly.
Solution Approach 2:
The foam protective material is designed as a single-use or limited-use component that is discarded after one packaging cycle. This eliminates the need to clean, sterilize, or maintain reusable foam inserts, reducing operational complexity and costs.
3Stability of the object's composition
If protective packaging materials with adhesive are used to secure semiconductor devices, then device stability during transport is improved, but residue removal and cleaning operations become more difficult
Solution Approach 1:
The foam protective material is designed as a disposable component that is discarded after single use. This eliminates all residue removal and cleaning operations, as the foam is thrown away rather than reused. The trade-off is acceptable because the foam is inexpensive and the elimination of cleaning operations provides significant operational benefits.
Solution Approach 2:
Instead of attempting to remove and reuse adhesive-based protective materials, the system is designed to discard the foam after one use. This approach recovers time and resources by eliminating the residue removal step entirely, while the low cost of the foam makes the disposable approach economically viable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively protects semiconductor devices from damage and contamination during transport and processing, reducing the risk of defects and associated costs by providing a cost-effective and efficient intermediate protection solution.
Implementation Method 1
the first protective sheet has an adhesive over at least a portion of a first side of the first protective sheet, and the first side is applied on the one or more partially-processed semiconductor devices
Implementation Method 2
removing the first protective sheet includes irradiating the protective sheet with UV light
Data Source
AI summary
Methods, systems and devices for protecting partially processed electronic parts, are disclosed. In some embodiments, a method for protecting electronic parts includes applying a first protective sheet on one or more partially-processed semiconductor devices, removing the first protective sheet, and performing a semiconductor-processing operation on the one or more partially-processed semiconductor devices. In some embodiments, a semiconductor processing system for protecting electronic parts includes one or more partially-processed semiconductor devices, and a first protective sheet applied on the one or more partially-processed semiconductor devices, the first protective sheet being subsequently removed, and a semiconductor-processing operation being performed on the one or more partially-processed semiconductor devices.