UV Semiconductor Package with Wavelength Conversion for Visual Confirmation
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Solution Overview
Problem
Semiconductor devices emitting ultraviolet light pose challenges in visual confirmation of operation and require effective heat dissipation and internal air pressure management.
Innovation Solution
A semiconductor device package incorporating a body with a cavity, a light-transmitting member, and an adhesive layer containing polymer resin and wavelength conversion particles that absorb ultraviolet light and emit visible light, allowing visual confirmation and improved heat dissipation through a structured design that includes conductive and insulating layers and a stepped portion for the light-transmitting member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a semiconductor device emits ultraviolet light, then it provides curing and sterilizing functions, but it becomes difficult to visually confirm whether the light source is operating normally
Solution Approach 1:
The patent applies wavelength conversion particles that convert ultraviolet light to visible light, enabling the invisible UV emission to be detected as visible light. This allows visual confirmation of the UV light source operation while maintaining its curing and sterilizing functions.
Solution Approach 2:
The patent introduces wavelength conversion particles as an intermediary substance between the UV light source and the human eye. These particles absorb UV light and emit visible light, serving as a mediator that translates the invisible UV radiation into visible signals for detection.
2Device complexity
If the internal air pressure is not adjusted, then the package structure remains simple, but adhesion failure may occur
Solution Approach 1:
The patent adjusts the internal air pressure of the package as a parameter change to prevent adhesion failure. By controlling the pressure environment inside the package, the reliability of adhesive bonding is improved without requiring complex structural modifications.
3Device complexity
If heat dissipation is not optimized, then the device structure remains simple, but heat accumulation reduces device reliability
Solution Approach 1:
The patent extracts heat from the semiconductor device through dedicated heat dissipation structures. By separating the heat management function from the basic device structure, effective heat removal is achieved while maintaining structural integrity and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables visual confirmation of ultraviolet light emission, reduces adhesion failure risk due to adjustable internal air pressure, and enhances heat dissipation efficiency.
Implementation Method 1
an adhesive layer configured to fix the light-transmitting member to the body, wherein the semiconductor device generates light in an ultraviolet wavelength band, and the adhesive layer includes a polymer resin, and wavelength conversion particles that absorb light in the ultraviolet wavelength band and generate light in a visible wavelength band
Data Source
AI summary
An embodiment discloses a semiconductor device package comprising: a body including a cavity; a semiconductor device disposed in the cavity; a light transmitting member disposed in the cavity; and an adhesive layer for fixing the light transmitting member to the body, wherein the semiconductor device generates light in an ultraviolet wavelength band, and the adhesive layer comprises polymer resin and wavelength conversion particles which absorb the light in the ultraviolet wavelength band and generate light in a visible wavelength band.