UV Sensor Doped Regions Block Visible Light
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Solution Overview
Problem
Traditional semiconductor-based light sensing devices for ultra-violet light suffer from interference from visible or infrared light due to the penetration of photoelectrons into the shallow semiconductor region, leading to a low signal/noise (S/N) ratio, and the manufacturing of multilayer filters is costly and inefficient.
Innovation Solution
The ultra-violet light sensing device incorporates a first conductivity type high density region under a second conductivity type region to form an electric potential barrier, trapping photoelectrons induced by longer wavelength light and preventing them from interfering with ultra-violet light sensing, while being manufactured using a standard semiconductor process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a multilayer filter is used to filter light of undesired wavelength band, then the S/N ratio in sensing ultra-violet light is improved, but the manufacturing cost increases and the yield rate decreases
Solution Approach 1:
The patent extracts the filtering function from a separate multilayer filter component and integrates it directly into the semiconductor substrate through doped regions. The first conductivity type substrate with second conductivity type regions creates built-in electric fields that selectively guide ultra-violet photoelectrons while blocking visible and infrared photoelectrons, eliminating the need for expensive precious metal filters and improving manufacturing yield.
Solution Approach 2:
The semiconductor substrate serves multiple functions simultaneously: it acts as both the photoelectric conversion medium and the wavelength-selective filter. The doped regions create electric fields that perform both charge collection and spectral filtering, combining what were previously separate functions into a single integrated structure that reduces manufacturing complexity and cost.
2Use of energy by moving object
If visible light or infrared light penetrates deeper semiconductor region to induce photoelectrons, then the light sensing capability is enhanced, but the interference with ultra-violet light sensing increases
Solution Approach 1:
The patent applies different conductivity types and doping densities at different locations within the semiconductor substrate. The first conductivity type substrate has specific doped regions with tailored electrical properties that create localized electric fields. These fields are configured to attract ultra-violet photoelectrons to the collection region while repelling or blocking visible and infrared photoelectrons, achieving wavelength-selective sensing through spatially varying electrical properties.
Solution Approach 2:
The built-in electric fields created by the doped regions act as intermediaries that selectively guide different types of photoelectrons. These electric fields mediate the movement of charge carriers by wavelength, directing ultra-violet photoelectrons to the collection electrode while preventing visible and infrared photoelectrons from reaching the sensing region, thus resolving the interference problem.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the S/N ratio for ultra-violet light sensing, reduces production costs, and simplifies the manufacturing process by effectively isolating unwanted photoelectrons and minimizing material loss.
Implementation Method 1
utilizes the first conductivity type high density region which is disposed under and adjacent to the second conductivity type region to form an electric potential barrier
Implementation Method 2
the ultra-violet light can only penetrate shallow semiconductor region to induce photoelectrons
Data Source
AI summary
The present invention provides an ultra-violet light sensing device. The ultra-violet light sensing device includes a first conductivity type substrate, a second conductivity type region, and a first conductivity type high density region. The first conductivity type substrate includes a light incident surface. The second conductivity type region is disposed in the first conductivity type substrate and adjacent to the light incident surface. The first conductivity type high density region is disposed under the second conductivity type region. The present invention also provides another ultra-violet light sensing device, which further includes a first conductivity type high density shallow region which is sandwiched between the light incident surface and the second conductivity type region. Manufacturing methods for these ultra-violet light sensing devices are also disclosed in the present invention.


