UV-Curable Silicone Adhesive Composition for Temporary Fixing

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Solution Overview

Problem

Existing silicone pressure-sensitive adhesive (PSA) compositions face issues with shrinkage upon cooling, dimensional errors, adhesive migration, and insufficient strength during micro-transfer-printing, particularly in UV-curable types lacking a resin component.

Innovation Solution

A UV-curable silicone PSA composition using an organopolysiloxane with specific (meth)acryloyloxy-containing groups and a siloxane-free monofunctional (meth)acrylate compound, along with a photopolymerization initiator, to achieve rapid curing with excellent adhesion and rubber strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If heat cure type silicone PSA compositions are used, then adhesive properties are achieved, but the cured product shrinks upon cooling resulting in increased dimensional errors

Engineering Contradiction:
Improveadhesive propertiesVSAvoiddimensional accuracy
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent changes the curing mechanism from thermal curing to UV photopolymerization curing. This parameter change eliminates the thermal expansion and contraction cycle that causes shrinkage and dimensional errors, while maintaining the adhesive properties through photopolymerization crosslinking of the silicone PSA composition.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the thermal curing mechanism (heat treatment) with a photopolymerization mechanism (UV irradiation). This substitution eliminates the need for heating and subsequent cooling that causes thermal shrinkage, thereby maintaining dimensional accuracy while achieving cure and adhesive properties.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If solid resin component is added as tackifier, then adhesive properties are improved, but uncrosslinked resin component causes adhesive migration and is left on chips or parts

Engineering Contradiction:
Improveadhesive propertiesVSAvoidadhesive migration
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent removes the solid resin component (tackifier) from the silicone PSA composition. By extracting this component that causes adhesive migration, the patent eliminates the harmful effect of resin being left on chips or parts, while maintaining adhesive properties through the photopolymerization-cured silicone network.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent changes the adhesive mechanism from relying on solid resin tackifiers to relying on photopolymerization-crosslinked silicone. This parameter change eliminates the migration issue associated with uncrosslinked resin components while maintaining pressure-sensitive adhesion through the cured silicone network.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If conventional silicone PSA compositions are used, then adhesive properties are achieved, but the material is insufficient in strength and undergoes cohesive failure upon molding and transferring

Engineering Contradiction:
Improveadhesive propertiesVSAvoidcohesive strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent creates a composite material system combining silicone PSA composition with photopolymerization initiator and (meth)acrylate monomers. This composite structure provides both adhesive properties from the silicone PSA and cohesive strength from the crosslinked polymer network, preventing cohesive failure during molding and transferring.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the curing mechanism to photopolymerization, which creates a crosslinked polymer network that significantly enhances cohesive strength. This parameter change prevents cohesive failure during molding and transferring operations while maintaining the adhesive properties of the silicone PSA composition.

Inventive Principle:
Principle #35Parameter changes

4Loss of time

If UV irradiation is used for curing, then curing time is reduced and dimensional accuracy is improved, but adhesive force and rubber strength are insufficient without resin component

Engineering Contradiction:
Improvecuring timeVSAvoidadhesive force
Core Design Contradiction:
Loss of timeVSReliability

Solution Approach 1:

The patent optimizes the composition parameters by incorporating specific ratios of (meth)acrylate monomers and photopolymerization initiators into the silicone PSA system. This parameter optimization enables complete photopolymerization crosslinking that provides sufficient adhesive force and rubber strength, eliminating the insufficiency issue while maintaining rapid UV curing and dimensional accuracy.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition cures quickly and effectively, providing a cured product with superior pressure-sensitive adhesion and rubber strength, suitable for temporary adhesion and fixing materials, while preventing adhesive migration and cohesive failure.

Implementation Method 1

a UV-curable silicone PSA composition comprising (A) 100 parts by weight of an organopolysiloxane having the general formula (1), (B) 1 to 200 parts by weight of a monofunctional (meth)acrylate compound free of a siloxane structure, and (C) 0.01 to 20 parts by weight of a photopolymerization initiator

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentEP3892701B1UV curable silicone adhesive composition and cured product thereof
Publication Date: 2026.03.04 SHIN ETSU CHEMICAL CO LTD
  • EP3892701B1 patent drawingFigure 1~3
  • EP3892701B1 patent drawing
  • EP3892701B1 patent drawing

AI summary

This UV curable silicone composition contains (A) an organopolysiloxane represented by general formula (1) [R1 represents a monovalent hydrocarbon group having 1-20 carbon atoms, R2 represents an aromatic group, X represents a group represented by formula (2), a, m, and n respectively represent numbers in the ranges of 1 ≤ a ≤ 3, 1 ≤ m ≤ 2,000, 1 ≤ n ≤ 2,000, and m/(n+m) ≥ 0.01 is satisfied. (R1 is as defined above. R3 represents an oxygen atom or an alkylene group having 1-20 carbon atoms, R4 represents an acryloyloxyalkyl group, a methacryloyloxyalkyl group, an acryloyloxyalkyloxy group, or a methacryloyloxyalkyloxy group, p represents a number in the range of 0 ≤ p ≤ 10, and c represents a number in the range of 1 ≤ c ≤ 3.)], (B) a mono-functional (meth)acrylate compound not containing a siloxane structure, and (C) a photopolymerization initiator, and provides, as a temporary fixing material, a cured product having excellent adhesiveness and rubber strength.