UV Tape Lead Frame Structure to Block Molding Overflow
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Solution Overview
Problem
Existing lead frames require complex manufacturing processes involving rib-cutting and electroplating, leading to increased costs and reduced efficiency due to molding material overflow and subsequent processes affecting outer leads.
Innovation Solution
Incorporation of a UV tape that covers and fills gaps between lead connections, preventing molding material overflow and allowing for simplified manufacturing by eliminating the need for rib-cutting and electroplating, with the tape being removable via UV light after molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional lead frame manufacturing processes are used, then structural integrity is maintained, but manufacturing complexity increases and productivity decreases due to required rib-cutting and electroplating steps
Solution Approach 1:
The patent extracts and eliminates the rib-cutting and electroplating steps from the traditional manufacturing process by using a molding layer with integrated reinforcing structures that perform the same function, thereby simplifying the process and improving productivity
Solution Approach 2:
The molding layer serves multiple functions simultaneously: it provides structural reinforcement, prevents material overflow, and eliminates the need for separate rib-cutting and electroplating operations, demonstrating multi-functionality that resolves the contradiction
2Manufacturing precision
If rib-cutting and electroplating processes are performed, then manufacturing precision is improved, but loss of time increases and productivity decreases
Solution Approach 1:
The reinforcing structures are pre-formed within the molding layer before the actual manufacturing process, so that when outer lead bending is needed, the precision is already ensured by the pre-positioned reinforcement, eliminating the need for time-consuming rib-cutting and electroplating steps
3Ease of manufacture
If gaps between adjacent leads are left open, then ease of manufacture is improved, but harmful factors increase due to molding material overflow affecting outer leads
Solution Approach 1:
The molding layer acts as an intermediary substance that fills the gaps between adjacent leads, preventing molding material from overflowing while maintaining ease of manufacture by allowing the molding process to proceed without complex restrictions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the manufacturing process, reduces costs, and improves efficiency by preventing molding material overflow and ensuring precise outer lead bending without additional equipment, while maintaining structural integrity during wire bonding and tie bar cutting.
Implementation Method 1
a UV tape covering a back surface and/or a front surface of the connection part of each of the leads and filling the gaps between the connection parts of the adjacent leads, the UV tape being configured to prevent molding layer material from overflowing
Implementation Method 2
the adhesive film losing or diminishing its adhesiveness under the irradiation of UV light
Data Source
AI summary
A lead frame includes a base island; a plurality of leads located around the base island, the adjacent leads having between them a gap, each of the leads comprising an inner lead close to the base island and an outer lead far away from the base island, the inner lead and the outer lead being connected by a connection part; a UV tape covering at least one of a back surface or a front surface of the connection part of each of the leads and filling the gaps between the connection parts of the adjacent leads, the UV tape being configured to prevent molding layer material from overflowing in the direction of the outer leads through the gaps between the adjacent leads during subsequent formation of a molding layer covering the base island and the inner leads, and the UV tape being peeled off after irradiation by a UV light after forming the molding layer.