UV-Transparent Element PCB Fixation in Medical Implants
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Solution Overview
Problem
Existing methods for fixing printed circuit boards in miniaturized electronic devices, such as medical implants, require significant real estate and high temperatures or long cure times, which can lead to stress on components and interconnect failures.
Innovation Solution
Incorporating a UV-transparent element, such as thin glass, along the perimeter of the printed circuit board allows for the use of UV-curable adhesives, enabling rapid and secure fixation without occupying valuable board space and avoiding high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal staking of polymer pins or ultrasonic staking is used to fixate the circuit board, then secure fixation is achieved, but larger board real estate is required and high temperatures or vibrations are applied near sensitive components
Solution Approach 1:
The fixation system is segmented into discrete fixation points distributed across the board perimeter, rather than requiring large continuous fixation areas. Each fixation point uses a small adhesive application area with corresponding mechanical features, allowing secure fixation while minimizing total board space consumption.
Solution Approach 2:
An adhesive layer acts as an intermediary between the circuit board and the mechanical support frame, enabling fixation without direct mechanical interference or thermal/vibrational exposure. The adhesive transfers loads chemically rather than through mechanical contact, eliminating the need for large fixation areas or harsh processing conditions.
2Reliability
If thermally cured adhesive resins are used to glue the PCB onto the support frame, then secure fixation is achieved, but long cure times and high temperatures are required which can damage or warp components
Solution Approach 1:
Thermal curing is replaced with UV光 curing, substituting a chemical-photochemical process for a thermal-chemical process. UV-curable adhesives cure upon exposure to ultraviolet light, achieving full strength in seconds rather than requiring prolonged high-temperature exposure, thus preventing damage to heat-sensitive electronic components.
Solution Approach 2:
The curing mechanism parameter is changed from thermal activation to UV光 activation. This allows the adhesive to cure at ambient temperatures under UV illumination, dramatically reducing both cure time and peak temperature requirements while maintaining fixation reliability.
3Reliability
If adhesive tapes or adhesive coatings are used to retain the circuit board, then fixation is achieved, but difficult handling or application and difficult positioning operations are required
Solution Approach 1:
Adhesive dispensing and positioning features are prepared in advance during PCB manufacturing. Fixation points with pre-formed mechanical features (such as recesses or protrusions) are created during board fabrication, and adhesive application patterns are predetermined, eliminating the need for difficult manual positioning and application operations during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the size and manufacturing time of the device, ensuring secure attachment of the circuit board while minimizing stress on components, thus preventing cracks and interconnect failures.
Implementation Method 1
at least one UV-transparent element is at least fixedly coupled to the printed circuit board, wherein the UV-transparent element is intended for fixation of the printed circuit board in an electronic device
Implementation Method 2
adhesive resins which generally have long cure/cooling cycle times of more than 10 minutes and high temperatures, up to 125°C, which can damage or warp other components
Data Source
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AI summary
The invention relates to an electronic device, in particular for a medical implant and a printed circuit board arrangement comprising a printed circuit board (10), wherein at least one UV-transparent element (20) is at least fixedly coupled to the printed circuit board (10), wherein the UV-transparent element (20) is intended for fixation of the printed circuit board (10) in an electronic device (100).