UV Wafer Center Finding for Precise Transparent Wafer Alignment
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Solution Overview
Problem
Current wafer positioning methods face challenges with alignment precision limits, particularly with increasing wafer sizes and decreasing feature sizes, and optically transparent wafers complicate accurate detection and positioning, leading to defects and increased costs.
Innovation Solution
A device using UV light sources and detectors to determine wafer coordinates, capable of detecting the wafer center with increased sensitivity and precision, applicable to various materials, including optically transparent wafers, and integrated into existing semiconductor manufacturing systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional optical sensors are used to detect wafer position, then the system can operate with conventional light sources, but the detection reliability decreases due to electrical noise, signal distortion, saturation, and interference issues
Solution Approach 1:
The patent changes the wavelength parameter of the light source from conventional visible light to UV range (10-400 nm). This parameter change allows the system to detect wafer position without suffering from electrical noise, signal distortion, saturation, and interference issues that affect traditional optical sensors, thereby improving signal reliability
Solution Approach 2:
The patent replaces traditional mechanical/optical sensor systems with a UV-based detection system. By using UV light sources and detectors sensitive to UV radiation, the system substitutes the conventional optical detection mechanism with one that is immune to the harmful electrical and optical interferences present in semiconductor manufacturing environments
2Measurement precision
If conventional optical methods are used for positioning, then the system design is simpler, but the positioning accuracy deteriorates with optically transparent wafers
Solution Approach 1:
The patent changes the detection wavelength to the UV range (10-400 nm), which interacts differently with optically transparent materials compared to visible light. This parameter change enables accurate detection of wafer position even when the wafer material is transparent to conventional optical wavelengths, thereby improving measurement precision for transparent wafers
3Productivity
If wafer size increases and feature size decreases, then more wafers can be processed, but alignment precision limits are reached with traditional methods
Solution Approach 1:
The patent uses UV light with wavelengths in the range of 10-400 nm, which provides higher resolution and precision for detecting wafer position and features. This parameter change in light wavelength enables accurate alignment measurements even as wafer sizes increase and feature sizes decrease, maintaining measurement precision while supporting higher productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device provides improved localization efficiency of wafer coordinates, enhancing alignment precision and reducing defects and costs by accurately determining the wafer center and radius, regardless of material type.
Implementation Method 1
a plurality of light sources, each light source being independently operable to emit UV light
Implementation Method 2
a plurality of detectors, each detector being independently operable to receive said UV light and produce an electrical signal
Data Source
AI summary
The present disclosure generally relates to the field of semiconductor processing, and in particular devices and methods for handling and accurately positioning wafers during various stages of semiconductor manufacturing. The present disclosure further relates to semiconductor processing systems comprising said specifically designed devices.