UWB Patch Antenna Layout Without Multi-Layer Via Complexity
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Solution Overview
Problem
Existing UWB antennas are complex and costly due to multi-layer structures with numerous via processes, and they are difficult to arrange and assemble within electronic device housings without bending flexible printed circuit boards.
Innovation Solution
A UWB antenna design featuring a dielectric substrate with first and second conductive layers, including patch antennas and transmission lines, where the second conductive layer overlaps with patch antennas and transmission lines, and incorporates slits to facilitate easy assembly and reduce complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multi-layer FPCB structure is used for UWB antenna, then the antenna can be implemented with patch antennas and transmission lines, but the structure becomes complex due to numerous via processes and increases manufacturing costs
Solution Approach 1:
The patent extracts the via processes from the multi-layer FPCB structure, eliminating the need for complex via connections between layers. The antenna elements are reconfigured to work on a single layer or with simplified interconnections, removing the problematic multi-layer via structure while maintaining antenna functionality.
Solution Approach 2:
The patent combines the antenna elements and transmission lines into a more integrated configuration that reduces the need for multiple layers. By merging functions and reconfiguring the layout, the design achieves the required antenna performance without relying on complex multi-layer stacking and via connections.
2Ease of operation
If patch antennas are assembled on FPCB, then the antenna can be connected to UWB communication circuit, but the FPCB bends and it becomes difficult to arrange antennas in the housing space
Solution Approach 1:
The patent transitions from a flexible multi-layer FPCB configuration to a more rigid planar structure that can be directly mounted on the housing. By changing the dimensional approach from stacked layers to a spread-out planar layout, the antenna elements can be arranged efficiently within the available housing space without requiring FPCB bending.
3Reliability
If numerous via processes are used to connect transmission line and patch antenna, then electrical connection can be achieved, but manufacturing costs increase
Solution Approach 1:
The patent removes the via processes from the manufacturing sequence, eliminating the costly and complex step of creating through-hole connections. The electrical connections are reconfigured to use surface-mounted traces and direct connections that can be formed using standard PCB fabrication processes without requiring via drilling and plating.
Data Source
AI summary
An ultra-wide band (UWB) antenna including a dielectric substrate, and first and second conductive layers arranged on opposite sides of the dielectric substrate. The first conductive layer includes a first, second and third patch antennae, each configured to receive a first UWB signal and a second UWB signal, wherein the second and third patch antennae are spaced apart from the first patch antenna in specific directions. The first conductive layer also includes first, second, and third transmission lines connecting, respectively, the first, second, and third patch antennae to a connector. The second conductive layer includes a ground pattern overlapping the first, second, and third patch antennae and the first, second, and third transmission lines, when facing the second conductive layer in a third direction that is perpendicular to the first direction and the second direction.