UWB Feed Circuit with Optical Substrate for Multi-Spectral RF Systems

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Solution Overview

Problem

Current waveguide feed lines in RF systems operate over a narrow bandwidth and are limited to single polarization, restricting their ability to support multi-spectral signal processing, which is essential for modern RF systems.

Innovation Solution

An ultra-wideband (UWB) feed circuit is created by combining a multi-layered RF feedline substrate with an optical substrate over a suspended air stripline, allowing for the propagation of both RF and optical/infrared signals, thereby widening the frequency bandwidth and enabling multi-frequency operation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a conventional waveguide feed line is used, then the structure is simple and easy to manufacture, but the bandwidth is narrow and it supports only single polarization

Engineering Contradiction:
ImprovebandwidthVSAvoidstructure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The feed line is divided into multiple segments including RF feed lines, optical feed lines, and hybrid sections. Each segment is optimized for specific frequency ranges and polarization modes, allowing the overall structure to support ultra-wideband operation across multiple bands while maintaining manageable complexity through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The waveguide structure is designed to perform multiple functions simultaneously: it supports both RF and optical frequencies, handles multiple polarization modes (horizontal and vertical), and provides both single-mode and dual-mode operation capabilities within a single integrated feed line system

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple feed lines are provided in microstrip configuration with lossy dielectric material, then multi-frequency operation is enabled, but ohmic losses and conduction current losses increase

Engineering Contradiction:
Improvemulti-frequency capabilityVSAvoidohmic loss
Core Design Contradiction:
Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The dielectric material parameters are carefully selected and optimized: using low-loss tangent materials with specific dielectric constants for different layers. The thickness and permittivity of each dielectric layer are tuned to achieve impedance matching and minimize losses across the ultra-wideband frequency range while maintaining multi-frequency operation

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The feed line employs composite structures combining different materials: low-loss dielectric substrates, metallic conductors with optimized thickness, and air gaps. This composite approach allows simultaneous achievement of low ohmic losses, wide bandwidth, and multi-frequency support by leveraging the complementary properties of each material

Inventive Principle:
Principle #40Composite materials

3Loss of energy

If laminated conductors are used to reduce ohmic losses, then conduction current losses are reduced, but the structure complexity increases

Engineering Contradiction:
Improveconduction lossVSAvoidconductor structure complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The conductor structure implements local quality optimization by using different conductor thicknesses and materials in different regions: thicker conductors where current density is high, thinner conductors where losses are less critical, and strategic placement of conductive layers to minimize overall ohmic losses while keeping the structure manageable

Inventive Principle:
Principle #3Local quality

4Adaptability or versatility

If a single aperture is used for both RF and optical/IR signals, then co-location is achieved, but the design complexity increases

Engineering Contradiction:
Improvemulti-mode aperture capabilityVSAvoidaperture design complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent separates RF and optical paths in the vertical dimension while maintaining horizontal co-location at the aperture. RF signals propagate through the waveguide mode, while optical signals use total internal reflection in the optical substrate, allowing both modes to share the same aperture location without interfering with each other's propagation mechanisms

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances RF insertion loss and bandwidth performance, supports multiple frequencies and polarizations, and allows for the co-location of RF and optical/IR apertures, enabling advanced multi-mode sensors and radar systems with improved dynamic radar cross-section tracking.

Implementation Method 1

an optical substrate disposed over a multi-layer dielectric substrate... allowing for the propagation of both RF and optical/infrared signals

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Implementation Method 2

The multi layered feed lines support multiple frequencies because of the skin effect of the metallic layers at various frequencies

Methodology Applied
Scientific EffectSkin effect: Skin Effect

Data Source

PatentUS9698458B2UWB and IR/optical feed circuit and related techniques
Publication Date: 2017.07.04 RAYTHEON CO
  • US9698458B2 patent drawing
  • US9698458B2 patent drawing
  • US9698458B2 patent drawing

AI summary

A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.