Carrierless UWB RF Wireless IC Testing
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Solution Overview
Problem
Integrated circuit testing is hindered by increasing complexity, requiring longer times and often necessitating physical probe testing, which is slow and incomplete, especially at the wafer level, where not all necessary testing can be effectively performed.
Innovation Solution
A testing system utilizing carrierless ultra-wideband (UWB) radio frequency (RF) signals to broadcast and receive test inputs simultaneously across multiple integrated circuits, eliminating the need for physical contact and enabling simultaneous testing, with results communicated via UWB RF, wired, or optical signaling, allowing for wafer-level testing and debugging during normal operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If physical probe testing is used to test integrated circuits, then testing can be performed at the wafer level, but the testing speed is slow due to serial movement of the probe from die to die
Solution Approach 1:
The patent replaces the mechanical probe system with an electromagnetic field-based testing system. Multiple integrated circuits are tested simultaneously using electromagnetic signals transmitted through the wafer substrate, eliminating the need for physical probe contact and serial testing. This substitution of mechanical testing with field-based testing enables parallel testing of multiple circuits, dramatically improving testing speed and reducing test time.
Solution Approach 2:
The patent merges multiple testing operations into a single simultaneous testing process. Instead of testing each die individually through serial probe movement, the system transmits test signals through the wafer substrate to test multiple integrated circuits at the same time. This consolidation of parallel testing operations into one unified process significantly increases productivity and reduces the time required to test the entire wafer.
2Reliability
If more thorough testing is performed after packaging, then testing completeness is improved, but testing time increases and wafer-level testing becomes insufficient
Solution Approach 1:
The patent performs comprehensive testing at the wafer level before packaging, rather than relying on post-packaging testing. By conducting thorough testing while the circuits are still on the wafer substrate using electromagnetic field penetration, the system achieves complete testing coverage early in the manufacturing process. This preliminary comprehensive testing eliminates the need for additional thorough testing after packaging, improving both reliability and productivity.
3Ease of operation
If physical contact probing is used, then testing can be performed, but the process is inherently slow and not all necessary testing can be effectively performed at the wafer level
Solution Approach 1:
The patent replaces mechanical probe contact with electromagnetic field-based testing. The system transmits electromagnetic signals through the wafer substrate to test multiple integrated circuits simultaneously without physical contact. This eliminates the inherent slowness of serial probe movement and enables effective wafer-level testing of all circuits in parallel, dramatically reducing testing duration while maintaining ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces test time by enabling simultaneous testing of multiple integrated circuits without physical contact, allowing for fully tested wafers and facilitating debugging within packages, thereby improving efficiency and reducing testing time while enabling wafer-level burn-in and in-package testing.
Implementation Method 1
Tests are broadcast to the plurality of integrated circuits using carrierless ultra wideband (UWB) radio frequency (RF)
Implementation Method 2
All of the plurality of integrated circuits receive, at the same time, test input signals by way of carrierless UWB RF
Data Source
AI summary
A testing system includes a tester probe and a plurality of integrated circuits. Tests are broadcast to the plurality of integrated circuits using carrierless ultra wideband (UWB) radio frequency (RF). All of the plurality of integrated circuits receive, at the same time, test input signals by way of carrierless UWB RF and all of the plurality of integrated circuits run tests and provide results based on the test input signals. Thus, the plurality of integrated circuits are tested simultaneously which significantly reduces test time. Also the tests are not inhibited by physical contact with the integrated circuits.