V-Groove Coupler Probe Device for Optical IC Wafer Testing
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Solution Overview
Problem
On-wafer device testing for optical integrated circuits (ICs) often requires significant space and effort for multiple channels, especially when using optical fibers that need to interface with vertical grating couplers or lenses, which can disrupt wafer production and increase costs.
Innovation Solution
A probe device that inserts optical fibers directly into v-groove couplers on the wafer, eliminating the need for additional structure and allowing for wafer-level sorting tests without interrupting production, by using a probe engagement mechanism with a fiber holder that aligns and secures optical fiber probes within the v-grooves for direct interfacing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If vertical grating couplers or lenses are used to interface optical fibers with IC devices, then optical signal transmission is achieved, but significant space and effort are required for multiple channels and production must be halted for wafer-level sorting tests
Solution Approach 1:
The patent merges the optical fiber coupling structure directly into the wafer substrate by fabricating v-groove couplers during the standard wafer fabrication process. This integration eliminates the need for separate coupling structures and allows multiple optical channels to be tested simultaneously on the wafer without halting production, thereby resolving the contradiction between productivity and device complexity
Solution Approach 2:
The v-groove couplers are fabricated in advance during the standard wafer fabrication process before the wafer is diced into individual IC devices. This preliminary action ensures that the coupling structures are already in place when the wafer reaches testing, eliminating the need for additional production steps and maintaining production continuity
2Ease of manufacture
If optical fibers interface with vertical grating couplers or lenses, then optical signal transmission is achieved, but manufacturing costs increase due to additional structure design and production interruptions
Solution Approach 1:
The patent combines the v-groove coupler fabrication into the standard wafer manufacturing process, eliminating the need for separate coupling structure fabrication. This integration reduces manufacturing costs by utilizing existing process steps while maintaining signal integrity through precise alignment of optical fibers with the v-groove couplers
Solution Approach 2:
The patent changes the coupling interface from vertical grating couplers or lenses to v-groove couplers that accept optical fibers in a lateral orientation. This parameter change in the coupling geometry simplifies the manufacturing process and reduces costs while maintaining reliable optical signal transmission through the v-groove structure
Data Source
AI summary
A probe device is configured to insert optical fiber probes directly into a v-groove coupler on an optical integrated circuit (IC) device. The probe device may include a probe holder comprising with a slot. A fiber holder may insert into the slot. The fiber holder may comprise a body with a first portion and second portion disposed at an angle relative to one another so that the first portion is shorter than the second portion. The body may have a bottom with grooves disposed therein, the grooves having dimensions to receive part of an optical fiber probes therein. In use, the fiber holder can arrange the optical fiber probes to extend into the v-grooves of the v-groove coupler of an optical IC on a wafer. The device may incorporate an alignment mechanism that permits the fiber holder to move or “self-align” in response to contact between the optical fiber probes and structure of the v-groove coupler of an optical IC on a wafer.