V-Groove Substrate Structures for Photonics Dicing Damage Prevention
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Solution Overview
Problem
In-plane coupling of optical fibers to silicon waveguides in photonics chips is inefficient due to damage from water jet pressure during dicing, which also leads to contamination and reliability issues.
Innovation Solution
A V-groove channel with a tapered undercut or extended groove and vias is formed in the substrate to reduce water pressure and prevent damage during dicing, using photolithographic processes and etching techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a groove or channel is formed underneath the Si waveguide to improve coupling, then optical coupling efficiency is improved, but the substrate becomes vulnerable to water jet pressure during dicing causing damage
Solution Approach 1:
A protective structure is formed in advance within the groove before dicing occurs. This structure is created during the groove formation process itself, preparing the groove to resist water jet pressure before the damaging force is applied during dicing operations.
Solution Approach 2:
The groove structure incorporates features that cushion or absorb the impact of water jet pressure before it can damage the substrate. The protective structure acts as a buffer, distributing and reducing the pressure exerted during dicing to prevent substrate failure.
2Strength
If water jet pressure is lowered during dicing to minimize damage, then substrate damage is reduced, but Si dust contamination increases affecting assembly and reliability
Solution Approach 1:
The invention converts the potentially harmful water jet pressure into a beneficial force by designing the groove structure to channel and direct the water flow. The groove guides the water jet along specific paths that enhance cleaning and cooling while preventing damage, turning a harmful factor into a useful one.
Data Source
AI summary
The disclosure relates to semiconductor structures and, more particularly, to structures for preventing dicing damage on photonics wafers. The structure includes: an optical waveguide structure to optical fiber interface formed on an integrated circuit; and a groove formed in a substrate and which includes a structure preventing a fluid pressure of a dicing operation from damaging the substrate along the groove.