V-Shaped LED Mounting Plate for Omnidirectional Light and Heat Dissipation
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Solution Overview
Problem
Conventional LED bulbs suffer from low light emitting angle and inefficient heat dissipation due to the use of plate substrates with insulation materials, limiting their application.
Innovation Solution
A light emitting diode (LED) bulb design featuring a metal plate bent into V-shaped chip mounting portions with varying LED chip arrangement densities to achieve omnidirectional light emission and improved heat dissipation through a copper or aluminum heat sink and molding compound encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED chips are arranged in high density on the entire plate substrate, then the light output intensity increases, but the light uniformity deteriorates due to proximity effects near junction areas
Solution Approach 1:
The patent applies local quality by varying the LED chip arrangement density across different regions of the mounting plate. Specifically, the first arrangement density in the first region is different from the second arrangement density in the second region, allowing high density in areas needing intensity while maintaining uniformity in junction proximity areas.
2Ease of manufacture
If plate substrate with insulation material is used, then the manufacturing process is simplified, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The patent uses a composite structure combining metal mounting plate with thermal conduction properties and insulation layers. The mounting plate is configured to conduct heat away from LED chips while insulation layers prevent heat transfer to sensitive components, achieving both thermal management and manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances light uniformity and heat dissipation efficiency, resulting in improved light emitting performance and reduced manufacturing costs.
Implementation Method 1
improved heat dissipation through a copper or aluminum heat sink
Implementation Method 2
A light emitting diode (LED) bulb includes a first chip mounting portion
Data Source
AI summary
A light emitting package includes a metal plate, a plurality of LED chips, a plurality of leads and a molding compound. The metal plate has a first surface and a second surface, and is bent into two chip mounting portions, wherein an inclination angle is between the chip mounting portions. The LED chips are mounted on the first surface and the second surface of the chip mounting portions. The leads are disposed adjacent to the metal plate and electrically connected to the LED chips. The molding compound encapsulates the LED chips and a part of the lead.