Vacuum Absorption Pad Gradient for Substrate Peeling
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Solution Overview
Problem
Existing substrate peeling methods for thin substrates used in display devices often result in damage due to uneven application of peeling forces, leading to bending or cracking of the substrates during the removal process.
Innovation Solution
A substrate peeling apparatus with a quadrangular support member and absorption pads of varying sizes, where the pads' internal diameter increases along the peeling direction, providing a proportional vacuum absorption force to match the contact area, allowing for controlled and precise peeling by applying an increasing pulling force from one corner to the center and then decreasing it to the opposite corner.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If uniform pulling force is applied during substrate peeling, then the peeling process is simple, but the thin substrate bends or cracks due to uneven force distribution
Solution Approach 1:
The absorption pads are designed with varying internal diameters to create non-uniform vacuum absorption forces. Pads closer to the corner where peeling initiates have smaller diameters, while pads farther away have larger diameters. This local variation in pad size creates a gradient of absorption forces that matches the stress distribution in the substrate, preventing bending and cracking while maintaining operational simplicity.
Solution Approach 2:
The internal diameter parameter of the absorption pads is systematically changed across different positions. By varying this geometric parameter, the vacuum absorption force is adjusted to create an increasing force gradient from the peeling initiation corner toward the opposite corner, ensuring uniform stress distribution and preventing substrate damage.
2Reliability
If increasing pulling force is applied from corner to center, then substrate peeling is achieved without damage, but the peeling process becomes more complex
Solution Approach 1:
The absorption pads are pre-configured with specific internal diameters before the peeling process begins. This preliminary design of varying pad sizes pre-establishes the required force gradient, eliminating the need for complex real-time force control mechanisms during peeling. The complexity is shifted from operational control to initial design, simplifying the actual peeling process.
Solution Approach 2:
The varying internal diameters of the absorption pads create a self-regulating force distribution system. As vacuum is applied, the different pad sizes automatically generate the required increasing force gradient from corner to center without external control intervention. The system serves itself by using its geometric configuration to achieve the desired force profile.
3Force
If larger absorption pads are used, then stronger vacuum absorption force is achieved, but the force distribution becomes uneven causing substrate damage
Solution Approach 1:
Rather than using uniformly large pads, the system employs locally optimized pad sizes. Pads in regions requiring stronger force (farther from the peeling corner) have larger diameters, while pads in regions requiring weaker force (closer to the corner) have smaller diameters. This local quality variation ensures both sufficient total force and proper force distribution.
Solution Approach 2:
The absorption pad configuration is intentionally asymmetric with respect to size distribution. The internal diameters are not uniform but follow a specific gradient pattern that is asymmetric relative to the substrate geometry. This asymmetry in pad sizing creates the necessary asymmetric force distribution to match the stress field during peeling, preventing damage while achieving strong overall absorption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise and accurate peeling of substrates without damage, ensuring the substrates are removed efficiently while preventing bending or cracking, thus maintaining their integrity.
Implementation Method 1
absorption pads of varying sizes, where the pads' internal diameter increases along the peeling direction, providing a proportional vacuum absorption force to match the contact area
Data Source
AI summary
A substrate peeling apparatus includes a support member and absorption pads. The support member, having a quadrangular shape, includes first and second vertexes diagonally facing each other in a first direction, and third and fourth vertexes diagonally facing each other in a second direction crossing the first direction. The absorption pads is disposed on the support member. The absorption pads are arranged in rows in a direction parallel to the first direction and at least one absorption pad of each row is arranged in a direction parallel to the second direction. An absorption pad of each row includes a hole having an increasing internal diameter as a distance in the first direction between the each row and the first vertex increases. An internal diameter of an absorption pad in a row positioned halfway between the first and second vertexes has a maximum internal diameter.