Vacuum Aligning Mechanism for Semiconductor Substrate Positioning
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Solution Overview
Problem
In inspection systems, accurately aligning substrates like semiconductor wafers with probe cards while maintaining a vacuum state and preventing displacement during transport is challenging, affecting the precision and reliability of electrical characteristic inspections.
Innovation Solution
An aligning mechanism with a mounting table, holding section, and lifting pins, where through-holes allow the pins to penetrate, supported by an aligner that adjusts the holding section's position, combined with displacement and vacuum leak prevention mechanisms, ensures precise alignment and maintains a vacuum state during substrate handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the mounting table is held from below with lifting pins, then the substrate can be transported and positioned, but displacement of the substrate may occur during transport
Solution Approach 1:
The patent replaces the mechanical lifting pin system with a magnetic field-based holding system. The holding section generates a magnetic field that acts on the substrate, eliminating mechanical contact points that cause displacement. This substitution maintains positioning stability while preventing the displacement issues associated with mechanical lifting pins during transport.
Solution Approach 2:
The patent employs a vacuum field (a form of pneumatic principle) through the holding section to secure the substrate. By creating a vacuum state, the substrate is held in place without mechanical contact, preventing displacement during transport while maintaining alignment precision throughout the inspection process.
2Ease of operation
If through-holes are formed in the holding section and aligner for lifting pin penetration, then the lifting mechanism can function, but vacuum leakage may occur
Solution Approach 1:
The patent extracts and eliminates the through-holes that cause vacuum leakage. Instead of having holes for lifting pin penetration, the design uses a solid holding section with magnetic or vacuum holding capabilities that maintain the vacuum state while still allowing the lifting mechanism to function through contactless or sealed contact methods.
Solution Approach 2:
By replacing the mechanical lifting pin system that requires through-holes with a magnetic field-based or vacuum-based holding system, the patent eliminates the need for through-holes. This substitution allows the lifting mechanism to operate while maintaining vacuum integrity, as no physical openings are required in the holding section or aligner.
3Manufacturing precision
If multiple components (mounting table, holding section, lifting pins, aligner) are used for substrate alignment, then positioning capability is achieved, but device complexity increases
Solution Approach 1:
The patent merges multiple components into integrated units. The holding section combines positioning, holding, and alignment functions into a single component. The aligner is integrated with the holding section, eliminating separate lifting pins and reducing the number of individual parts. This merging maintains precise alignment capability while significantly reducing device complexity.
Solution Approach 2:
The holding section is designed as a multi-functional component that performs holding, positioning, and alignment operations simultaneously. By making the holding section universal, the patent eliminates the need for separate lifting pins and aligner components, reducing overall device complexity while maintaining full substrate alignment capability throughout the inspection process.
Data Source
AI summary
An aligning mechanism according to one aspect of the present disclosure includes a mounting table on which a substrate is placed; a holding section configured to hold the mounting table from below; lifting pins configured to raise or lower the mounting table with respect to the holding section; and an aligner configured to support the holding section from below, and to change a position of the holding section relative to the lifting pins. In the holding section and the aligner, through-holes are formed such that the lifting pins can penetrate the through-holes.