Vacuum-Attached Thin Glass Substrate for LCD Weight Reduction
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Solution Overview
Problem
The challenge is to reduce the weight and size of liquid crystal display (LCD) devices while maintaining their quality and preventing foreign materials and air foam from entering the gap between glass substrates, which is difficult with conventional etching processes that increase surface roughness and complexity.
Innovation Solution
A method involving a thin glass substrate and an auxiliary substrate attached in a vacuum state without etching, using atmospheric pressure to secure them, preventing foreign materials and air foam entry and simplifying the fabrication process by eliminating the need for adhesives and additional panel etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If conventional etching processes are used to reduce glass substrate thickness, then the weight and size of LCD devices can be reduced, but surface roughness increases and the glass substrate becomes more prone to damage
Solution Approach 1:
The patent applies preliminary action by pre-attaching the thin glass substrate to a support substrate before the etching process. This support structure prevents the thin glass substrate from breaking during subsequent handling and processing steps, allowing the use of thinner glass (0.1-0.4mm) without compromising structural integrity during manufacturing.
Solution Approach 2:
The support substrate acts as an intermediary that temporarily reinforces the thin glass substrate during the fabrication process. This mediator provides the necessary mechanical strength to handle and process the thin glass without direct etching, eliminating the need for thick glass while maintaining durability throughout manufacturing.
2Length of moving object
If conventional etching processes are used on glass substrates, then substrate thickness can be reduced, but surface roughness increases leading to potential contamination and foreign material entry
Solution Approach 1:
The patent replaces the mechanical etching process with a vacuum attachment system. Instead of using chemical or mechanical etching to reduce thickness, the thin glass substrate is attached to a support substrate in a vacuum environment, preserving the original smooth surface while achieving the desired thin profile through material selection rather than material removal.
Solution Approach 2:
The patent uses a vacuum environment (inert atmosphere) during the attachment process to prevent contamination. By performing the attachment in vacuum, foreign materials and air foam are excluded from the interface between substrates, maintaining surface cleanliness and preventing contamination without requiring surface etching.
3Weight of moving object
If thin glass substrates are used without support, then weight and thickness are reduced, but the substrates become vulnerable to breaking and foreign material entry
Solution Approach 1:
The support substrate is attached to the thin glass substrate in advance (preliminary action) to provide mechanical reinforcement. This preliminary support structure prevents breaking during handling and assembly, enabling the use of ultra-thin glass substrates (0.1-0.4mm) while maintaining the reliability and durability needed for commercial LCD devices.
Solution Approach 2:
The patent creates a composite structure by bonding the thin glass substrate to a support substrate. This composite construction combines the optical properties of thin glass with the mechanical strength of the support material, achieving both weight reduction and enhanced durability simultaneously.
4Strength
If adhesives are used to attach substrates, then bonding strength is achieved, but fabrication complexity and cost increase
Solution Approach 1:
The vacuum attachment system uses the vacuum environment itself to provide the bonding force, eliminating the need for separate adhesives or bonding agents. The pressure differential created by vacuum suction automatically bonds the substrates together, simplifying the fabrication process and reducing the number of materials and steps required.
Solution Approach 2:
The patent replaces chemical bonding (adhesives) with a physical bonding mechanism (vacuum suction). This substitution eliminates the need for adhesive application, curing, and related processes, significantly simplifying the fabrication process while maintaining strong substrate attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a lighter, thinner LCD device with improved durability and reduced fabrication costs, preventing substrate damage and contamination, while enhancing viewing angles and brightness for 3D displays.
Implementation Method 1
contacting the second substrate and the second auxiliary substrate with each other in a vacuum state
Implementation Method 2
forming an atmospheric state at the out region of the contacted second substrate and second auxiliary substrate to press the contacted second substrate and second auxiliary substrate by the atmospheric pressure in order to attach the second substrate and the second auxiliary substrate
Data Source
AI summary
A method for fabricating a process substrate includes: providing a first substrate; providing a substrate and an auxiliary substrate; contacting the substrate and the auxiliary substrate with each other in a vacuum state, thereby forming micro spaces of a vacuum state between the substrate and the auxiliary substrate; and increasing a pressure at the outside of the contacted substrate and auxiliary substrate to attach the substrate and the auxiliary substrate to each other by a pressure difference between the micro spaces and the outside of the contacted substrate and auxiliary substrate.