Vacuum Bagging Flash Control via Porous Plies
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Solution Overview
Problem
The existing vacuum bagging process for adhesive metal bonding in aircraft manufacturing often results in undesirable adhesive flash, which increases weight, interferes with adjoining parts, and requires costly post-bonding processes for removal, complicating the manufacturing process and potentially damaging corrosion protection.
Innovation Solution
The method involves using a porous peel ply and breather ply to capture adhesive seepage during thermal curing, reducing the formation of cured adhesive flash by preselecting these plies to channel and remove the excess adhesive, thereby minimizing post-processing needs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If vacuum bagging is used for adhesive metal bonding, then the bonding process is simplified and manufacturing efficiency is improved, but adhesive flash forms during curing which increases weight and requires post-processing
Solution Approach 1:
The invention extracts and removes the harmful adhesive flash from the bonding process by using a specialized vacuum bag configuration with absorbent material that captures and contains the flash during curing, preventing it from contaminating the bonded joint
Solution Approach 2:
The invention introduces an intermediary absorbent material within the vacuum bag that acts as a mediator between the adhesive flash and the bonded joint, capturing the flash and preventing direct contamination of the metal surfaces
2Manufacturing precision
If adhesive flash is removed by post-bonding processes such as sanding, grinding, or blasting, then the flash is eliminated, but production time increases and corrosion protection is compromised
Solution Approach 1:
The invention performs the flash capture action preliminarily during the bonding process itself rather than requiring subsequent removal operations, by configuring the vacuum bag with absorbent material that captures flash as it forms during curing
3Manufacturing precision
If flashbreaker tape is used to mask the bond joint edge, then adhesive flash is captured and removed with the tape, but process complexity and manufacturing cost increase
Solution Approach 1:
The invention makes the vacuum bag itself multi-functional by configuring it with integrated absorbent material, allowing it to perform both the sealing function and the flash capture function simultaneously, eliminating the need for separate flashbreaker tape
4Manufacturing precision
If pressure strip is used to block adhesive seepage, then flash formation is reduced, but the full volume of adhesive remains in the assembly increasing weight
Solution Approach 1:
The invention extracts the adhesive flash from the bonded assembly by using absorbent material within the vacuum bag that captures and contains the flash during curing, removing it from the final product
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the size of adhesive flash, decreases production costs, and maintains corrosion protection, simplifying the manufacturing process by eliminating the need for extensive post-bonding deflashing operations.
Implementation Method 1
the breather and peel plies being preselected to capture adhesive seepage from the lap joint
Implementation Method 2
a porous peel ply and breather ply to capture adhesive seepage during thermal curing
Implementation Method 3
the plates being initially clamped together by applying vacuum through the breather ply
Implementation Method 4
applying vacuum through the breather ply; with the adhesive being thermally cured
Implementation Method 5
the adhesive is thermally cured in a predetermined curing cycle typically conducted at elevated temperature and pressure
Implementation Method 6
The initially solid adhesive film softens during thermal curing and decreases in viscosity as temperature rises
Data Source
AI summary
A bonding method includes vacuum bagging a second metal plate atop a first metal plate, with a thermosetting adhesive in a lap joint therebetween covered in turn by a porous peel ply and a porous breather ply; the plates being initially clamped together by applying vacuum through the breather ply; and thermally curing the adhesive, with the breather and peel plies being preselected to capture adhesive seepage from the lap joint and removed with the plies to correspondingly reduce cured adhesive flash.