Vacuum-Based Closed-Loop Thermal Management for Low-Pressure Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current thermal management systems face challenges in effectively handling increasing heat dissipation in miniaturized electronic devices, with existing solutions approaching physical and thermodynamic limitations, and requiring complex pressure management systems that are not suitable for all environments, such as flight.
Innovation Solution
A vacuum-based closed loop cooling system that uses a coolant transitioning between liquid and gas phases to absorb heat through latent heat, with a vacuum generator reducing boiling temperature and eliminating the need for high-pressure components, allowing for efficient cooling independent of surrounding conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal management systems use high-pressure cooling methods, then cooling effectiveness is improved, but system complexity and requirement for special pressure-resistant components increases
Solution Approach 1:
The patent changes the pressure parameter from high-pressure to vacuum (low-pressure) conditions, allowing the coolant to boil at lower temperatures and achieve effective cooling without requiring complex pressure-resistant components. The vacuum condition enables phase change cooling at temperatures suitable for electronic devices without the need for special piping, connectors, and sealants.
Solution Approach 2:
The patent utilizes phase transition of the coolant from liquid to gas in the evaporating chamber under vacuum conditions. This phase change absorbs heat from the electronic components, providing effective cooling. The vapor then condenses back to liquid in the condensing chamber, completing the cycle without requiring high-pressure systems.
2Volume of moving object
If thermal management systems are integrated into miniaturized electronic devices, then device size is reduced, but heat flux density increases making cooling more difficult
Solution Approach 1:
The patent employs phase transition of the coolant within the miniaturized device structure. The coolant evaporates in contact with heat-generating components, absorbing intense heat flux, then condenses in a separate chamber. This phase change mechanism provides high heat transfer efficiency suitable for miniaturized devices with high heat flux density.
Solution Approach 2:
The patent divides the thermal management system into separate functional chambers: an evaporating chamber that contacts heat-generating components and a condensing chamber for vapor condensation. This segmentation allows optimized heat transfer in each zone while maintaining a compact overall structure suitable for miniaturized electronics.
3Device complexity
If standard active thermal management systems operate at ambient pressure, then system simplicity is maintained, but they require pressure-protecting measures during flight or low-pressure environments
Solution Approach 1:
The patent operates the thermal management system under vacuum conditions rather than ambient pressure. This parameter change eliminates the need for pressure-protecting measures during flight or in low-pressure environments, as the system is designed to function optimally in vacuum. The vacuum condition also enables lower boiling point of the coolant, enhancing cooling efficiency.
Solution Approach 2:
The patent creates a vacuum (inert environment) within the thermal management system, which serves dual purposes: it enables effective phase change cooling and makes the system inherently adaptable to flight conditions and low-pressure environments without requiring additional pressure protection mechanisms.
4Temperature
If cooling systems use expendable liquid or large-scale refrigeration, then cooling capacity is achieved, but space consumption and energy consumption increase
Solution Approach 1:
The patent uses a closed-loop system where the coolant continuously cycles between liquid and vapor phases. The phase change from liquid to vapor in the evaporating chamber provides intense cooling capacity, while the compact condensing chamber condenses the vapor back to liquid. This eliminates the need for large-scale refrigeration systems or expendable liquids, achieving high cooling capacity in a compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high-performance, cost-effective, and reliable cooling with reduced dependence on surrounding conditions, enabling cooling to low temperatures without the need for pressure-protecting measures, suitable for various applications including electronic devices and human bodies.
Implementation Method 1
the coolant is transferred (e.g. periodically or continuously) in between its liquid and gas phases while in the cooling interface. Thus, the coolant flows in a closed loop, absorbing heat through the phase change thereof from liquid to gas
Implementation Method 2
an active vacuum generator is used for applying, and maintaining by demand, partial vacuum in the cooling zone and thus reducing the boiling temperature of the coolant
Implementation Method 3
dissipating it to the environment, typically through a coolant condensation
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A thermal management system and method are presented for cooling an entity. The system comprises: a closed loop fluid flow line for flow of a coolant while being transferred in between its liquid and gas phases; at least one cooling zone located within the flow line and comprising at least one cooling interface; a vacuum generator unit operable for creating and maintaining vacuum condition at the cooling zone to thereby reduce evaporation temperature of the coolant located in the cooling zone; and a condensation zone spaced apart from the cooling interface downstream thereof with respect to a direction of the coolant flow from the cooling zone along the closed loop path wherein the coolant is condensed to liquid phase.