Vacuum Carrier Module for Residue-Free Chip Detachment
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Solution Overview
Problem
Current semiconductor manufacturing processes face challenges in efficiently separating semiconductor chips from release films, particularly in UV release processes where transparency of the carrier to UV radiation is required, limiting the effectiveness of adhesive strength reduction.
Innovation Solution
A vacuum carrier module is introduced, featuring a substrate with holes and an edge region, where a gel film is attached and an alignment material is used to planarize the gel film, allowing for chip placement and subsequent molding, followed by vacuum detachment of the gel film from the cured molding material, enabling reusable and residue-free chip handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If UV radiation is used to reduce adhesive strength of the release film, then the chip separation process is simplified, but the carrier must be transparent to UV radiation which limits the effectiveness of adhesive strength reduction
Solution Approach 1:
A vacuum carrier module is introduced as an intermediary device between the release film and the processing environment. The module includes a substrate with a vacuum chamber that can hold and manipulate the release film with chips during separation processes, providing mechanical control and stability while enabling effective adhesive strength reduction through vacuum application
Solution Approach 2:
The patent replaces or supplements the UV radiation-based adhesive strength reduction with a vacuum-based mechanical system. The vacuum carrier module uses vacuum pressure to facilitate chip separation from the release film, providing a more reliable and controllable mechanism that does not depend on UV transparency of the carrier material
2Reliability
If thermal release process is used to separate chips from release film, then adhesive strength is reduced effectively, but additional heating equipment and process control are required
Solution Approach 1:
The patent replaces the thermal release mechanism with a vacuum-based mechanical system. The vacuum carrier module uses vacuum pressure to detach chips from the release film without requiring heating equipment, thereby maintaining reliable adhesive strength reduction while significantly simplifying the device complexity and eliminating thermal process control requirements
Solution Approach 2:
The invention employs vacuum pressure (a pneumatic principle) to achieve chip separation from the release film. The vacuum carrier module creates a pressure differential that facilitates effective detachment, providing a simple yet reliable alternative to thermal processes without requiring complex heating and temperature control systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the efficiency of chip separation and reuse by maintaining the gel film's planarity and preventing residue collection, improving the semiconductor manufacturing process through effective alignment and detachment mechanisms.
Implementation Method 1
vacuum detachment of the gel film from the cured molding material
Data Source
AI summary
A vacuum carrier module includes a substrate having at least one hole and an edge region. There is at least one support on a top surface of the substrate. Further, a gel film is adhered to the edge region of the substrate. The at least one hole fluidly connects a reservoir located above the top surface of the substrate. A method of using a vacuum carrier module includes planarizing a gel film by passing an alignment material through a hole in a substrate to contact a first surface of the gel film, positioning at least one chip on a second surface of the gel film opposite the first surface. The method further includes encasing the at least one chip in a molding material and applying a vacuum to the first surface of the gel film.