Encapsulated Vacuum Cavity for Low-Loss Superconducting Qubits
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Solution Overview
Problem
The fidelity of quantum computers is compromised by material losses in components such as transmon qubit shunt capacitors and resonators, which are typically formed on silicon substrates that form amorphous native oxides when exposed to the atmosphere, leading to increased dielectric loss.
Innovation Solution
A qubit device with a superconducting circuit is fabricated on an encapsulated vacuum cavity, where an epitaxial film is grown on the internal surfaces of the cavity to prevent oxidation and reduce dielectric loss, using techniques like epitaxial deposition and hermetic sealing to maintain a crystalline environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If superconducting circuits are formed on silicon substrates exposed to atmosphere, then manufacturing is simplified, but dielectric loss increases due to amorphous native oxide formation
Solution Approach 1:
The patent applies the inert atmosphere principle by creating a vacuum environment within an encapsulated cavity. The superconducting circuit is formed on a substrate inside this vacuum cavity, preventing atmospheric exposure and subsequent amorphous oxide formation. The vacuum environment maintains the substrate surface in a pristine state, eliminating dielectric loss from native oxide layers while preserving manufacturing simplicity.
Solution Approach 2:
The patent applies parameter changes by transitioning the substrate environment from atmospheric conditions to vacuum conditions. This parameter change (from ambient pressure to vacuum) fundamentally alters the surface chemistry of the substrate, preventing oxidation and maintaining low dielectric loss. The encapsulation structure permanently maintains this optimized parameter state.
2Loss of energy
If vacuum encapsulation is implemented to prevent oxidation, then dielectric loss is reduced, but device complexity increases
Solution Approach 1:
The patent applies the merging principle by integrating the vacuum cavity formation and superconducting circuit fabrication into a single unified process sequence. The cavity is formed, the substrate is transferred inside, and the superconducting circuit is deposited all within the same vacuum environment without breaking the vacuum seal. This merging of processes minimizes the number of vacuum breaks and simplifies the overall device structure.
Solution Approach 2:
The patent applies universality by designing the encapsulated vacuum cavity to serve multiple functions simultaneously: it provides mechanical support, creates the vacuum environment, prevents oxidation, and enables the superconducting circuit operation. This multi-functionality reduces the need for additional separate components, thereby managing device complexity.
3Loss of energy
If epitaxial films are grown on cavity surfaces, then oxidation is prevented and dielectric loss is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies the inert atmosphere principle by maintaining vacuum conditions during epitaxial film growth on the cavity internal surfaces. This vacuum environment prevents oxidation during the deposition process and ensures high-quality crystalline films with low dielectric loss. The inert environment allows for precise control of film properties without the complications of atmospheric interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces energy loss and improves the coherence time and performance of quantum computing devices by maintaining regions of low dielectric loss within the vacuum cavity, enhancing the fidelity of quantum computations.
Implementation Method 1
an epitaxial film is grown on the internal surfaces of the cavity to prevent oxidation and reduce dielectric loss, using techniques like epitaxial deposition
Implementation Method 2
hermetic sealing to maintain a crystalline environment
Data Source
AI summary
Devices, systems, methods, and/or computer-implemented methods that can facilitate a qubit device comprising a superconducting circuit provided on an encapsulated vacuum cavity are provided. According to an embodiment, a device can comprise a substrate having an encapsulated vacuum cavity provided on the substrate. The device can further comprise a superconducting circuit provided on the encapsulated vacuum cavity.