Vacuum Chamber Decompression Drying for Moisture in Microvoids
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing vacuum drying methods in substrate processing apparatuses are inefficient in removing moisture from microvoids on part surfaces, leading to prolonged drying times and residual moisture that can react with processing gases, causing discoloration or deterioration.
Innovation Solution
A decompression processing method that introduces an additional gas to adsorb and evaporate moisture in a controlled pressure and temperature environment, repeatedly forming and removing a mixture with the moisture to ensure complete drying.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If conventional vacuum drying methods are used, then the chamber can be dried, but the drying time is prolonged and moisture in microvoids cannot be effectively removed
Solution Approach 1:
The patent changes the physical parameters of the drying process by introducing a third substance that forms a low-boiling-point mixture with moisture. This allows the mixture to evaporate at lower temperatures and faster rates than pure water, thereby reducing drying time while effectively removing moisture from microvoids through the carrier gas flow.
Solution Approach 2:
The patent uses a third substance (carrier gas or volatile compound) as an intermediary that facilitates moisture removal. This intermediary substance mixes with moisture to form a volatile mixture that can be easily evaporated and removed by vacuum decomposition, solving the problem of slow conventional drying while ensuring complete moisture elimination.
2Productivity
If heating is applied to accelerate evaporation, then drying speed increases, but energy consumption increases and risk of substrate damage increases
Solution Approach 1:
The patent exploits phase transition properties by selecting a third substance with low boiling point that forms a volatile mixture with moisture. The mixture undergoes rapid evaporation at lower temperatures, achieving fast drying speed without requiring high energy input or excessive heating that could damage substrates.
Solution Approach 2:
The patent replaces thermal heating methods with a chemical-physical approach using volatile substance mixing and vacuum decomposition. This substitution eliminates the need for high-energy heating while maintaining high drying speed through the inherent volatility of the mixture and the decompression process.
3Reliability
If vacuum decompression is applied, then moisture can be removed, but residual moisture in microvoids remains
Solution Approach 1:
The patent introduces a third substance as an intermediary carrier that penetrates microvoids and forms a volatile mixture with trapped moisture. This intermediary substance enables complete moisture removal from difficult-to-reach areas by creating a mixture that can be efficiently evacuated through vacuum decompression, solving both completeness and time efficiency problems.
Solution Approach 2:
The patent changes the volatility parameters of the moisture by mixing it with a low-boiling-point third substance. This parameter change allows the moisture-mixture to be completely removed from microvoids through vacuum decompression at faster rates, achieving both complete removal and reduced drying time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly shortens drying time and effectively removes moisture from the vacuum chamber, preventing residual moisture issues and ensuring efficient substrate processing.
Implementation Method 1
introduces an additional gas to adsorb and evaporate moisture in a controlled pressure and temperature environment
Implementation Method 2
decompressing the inside of the chamber via operation of a decompression apparatus that reduces a pressure inside the chamber and removes the mixture in a gaseous form
Implementation Method 3
A mixture of the moisture with the additional substance is formed. The method includes decompressing the inside of the chamber via operation of a decompression apparatus that reduces a pressure inside the chamber and removes the mixture in a gaseous form
Data Source
AI summary
There is provided a decompression processing method for a substrate processing apparatus including a chamber for processing a substrate in an inside thereof, a decompression unit that decompresses the inside of the chamber, and a gas supply that supplies a gas into the inside of the chamber, the method including supplying an additional substance mixable with moisture in a liquid or solid state by the gas supply to the inside of the chamber, forming the moisture into a mixture of the additional substance, and decompressing the inside of the chamber by the decompression unit to remove as a gas the mixture from the inside of the chamber.