Vacuum Chamber Electrostatic Chuck Solder Bonding
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Solution Overview
Problem
Conventional methods for bonding components with dissimilar materials in vacuum process chambers, such as electrostatic chucks, face challenges in creating a hermetic seal due to differing coefficients of thermal expansion, often resulting in stress and leaks when using soldering or brazing techniques.
Innovation Solution
A hermetic seal is achieved by using a solder bond between two pieces, with an o-ring compressed between them, where the solder bond is formed using an electrically ignited reactive foil material, allowing for a low-temperature bonding process that prevents heat from affecting the o-ring and maintaining a seal even under vacuum and atmospheric pressure differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional soldering or brazing techniques are used to bond dissimilar materials (metal and ceramic) with different coefficients of thermal expansion, then the components are joined together, but thermal stresses and cracks occur due to differential expansion and contraction
Solution Approach 1:
The patent changes the temperature parameter by using a low-temperature soldering process (below 150°C) instead of conventional high-temperature soldering or brazing. This temperature reduction prevents thermal stress and cracking in ceramic components while still achieving reliable bonding between dissimilar materials through specialized low-temperature solder alloys and fluxes.
2Strength
If high-temperature soldering or brazing is used to create a hermetic seal between dissimilar materials, then strong bonding is achieved, but the o-ring and other components are damaged by heat
Solution Approach 1:
The patent changes the temperature parameter to below 150°C, which is low enough to preserve the elasticity and sealing properties of the o-ring while still achieving adequate bond strength through low-temperature soldering techniques, including specialized solder alloys and surface preparation methods.
3Reliability
If an o-ring is used to provide a hermetic seal between components with different thermal expansion coefficients, then sealing is achieved, but leaks occur under vacuum pressure due to differential expansion
Solution Approach 1:
The patent reduces the processing temperature to below 150°C, which minimizes thermal expansion differences between dissimilar materials. This temperature control prevents distortion and maintains dimensional stability, ensuring the o-ring seal remains effective under vacuum conditions without leaking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a reliable, leak-proof seal between components with different thermal expansion coefficients, allowing for efficient heat transfer and easy detachment for maintenance, while maintaining the integrity of the vacuum environment.
Implementation Method 1
The reactive foil is ignited to locally heat the foil and form a low temperature solder bond between the first piece and the second piece
Implementation Method 2
at least one o-ring compressed between the first piece and the second piece
Data Source
AI summary
A vacuum process chamber component comprising two separate pieces with an o-ring between the pieces and solder bonded together is described. The component may be an electrostatic chuck comprising a ceramic electrostatic puck and a metal baseplate with at least one o-ring therebetween and joined by a solder bond is described. Methods of making and using vacuum process chamber component are also described.