Vacuum Transfer Chamber Layout for High-Throughput Substrate Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional substrate processing systems in Ultra High Vacuum environments face limitations in throughput due to the handling sequence and footprint constraints, particularly in systems with twin transfer chambers and bi-symmetric robots, which restrict the number of process modules and increase the tool's footprint.
Innovation Solution
A substrate processing system with a single transfer vacuum chamber equipped with two 'five axis' transfer robots and multiple load lock chambers, allowing for efficient substrate transfer and processing without additional transfer vacuum chambers or load lock chambers, and enabling a compact footprint by optimizing the placement of substrate modules and load lock chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single transfer vacuum chamber with two load lock chambers is used, then the footprint is minimized, but the throughput is limited by the handling sequence
Solution Approach 1:
The system divides the transfer chamber into multiple independent process modules (PM1, PM2, PM3, PM4) that can operate in parallel. Each module has dedicated substrate processing capabilities, allowing simultaneous processing of multiple substrates without sequential handling delays, thus increasing throughput while maintaining a compact footprint.
Solution Approach 2:
The transfer chamber is configured with a three-dimensional arrangement of process modules and load lock chambers, utilizing vertical and radial space efficiently. The bi-symmetric robot operates in a three-dimensional workspace with multiple degrees of freedom, enabling substrate transfer to multiple process modules without increasing the horizontal footprint.
2Productivity
If two transfer chambers with multiple load lock chambers are used, then the throughput is increased, but the footprint increases
Solution Approach 1:
The system merges the functions of multiple transfer chambers into a single integrated transfer vacuum chamber. The bi-symmetric robot performs substrate transfer operations to multiple process modules within this single chamber, eliminating the need for separate transfer chambers and reducing the overall footprint while maintaining high throughput through parallel processing.
Solution Approach 2:
The single transfer vacuum chamber is designed as a multi-functional workspace that can accommodate multiple process modules (PM1-PM4) and multiple load lock chambers (LL1-LL4). The bi-symmetric robot provides universal substrate transfer capability to all modules, making the system more compact compared to dedicated transfer chambers for each function.
3Productivity
If the number of process modules is increased, then the productivity is improved, but the handling time becomes a limiting factor
Solution Approach 1:
The system enables continuous substrate processing by implementing parallel processing paths through multiple process modules. While one substrate is being processed in PM1, another can be simultaneously processed in PM2, eliminating idle handling time and maintaining continuous productive action across the system.
Solution Approach 2:
Substrates are pre-positioned in load lock chambers (LL1-LL4) before being transferred to process modules. This preliminary loading allows the bi-symmetric robot to pick up substrates immediately when needed, reducing waiting time and ensuring continuous operation without idle handling periods.
4Area of stationary object
If a bi-symmetric robot is used in a transfer chamber, then the footprint is reduced, but the number of process modules is limited
Solution Approach 1:
The bi-symmetric robot is designed with dynamic capabilities including multiple degrees of freedom and adjustable positioning. This allows the robot to efficiently access and transfer substrates to multiple process modules (PM1-PM4) arranged in a compact configuration, maximizing the number of modules that can be accommodated within the transfer chamber without increasing footprint.
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
A substrate processing system and a method of processing a substrate using a substrate processing system are provided.