Vacuum Chip Ejection Structure for Low-Stress Die Pickup
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Solution Overview
Problem
Existing semiconductor chip ejecting devices apply significant stress to miniaturized and thinned chips during the pickup process, leading to potential damage such as cracking.
Innovation Solution
A chip ejecting apparatus with a body featuring vacuum holes and an ejecting bar that minimizes stress by pushing up semiconductor chips through face-to-face contact, using vacuum suction to fix adjacent chips, and an edge groove to facilitate easy separation from the mount tape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a needle or pin is used to push up semiconductor chips for separation from mount tape, then chip pickup is enabled, but significant stress is applied to miniaturized and thinned chips causing damage such as cracking
Solution Approach 1:
The patent replaces the mechanical needle/pin pushing system with a vacuum-based adsorption system. The ejecting device uses vacuum suction through multiple vacuum holes to adsorb and push up chips for separation, eliminating the mechanical contact stress that causes chip cracking while maintaining effective pickup capability.
Solution Approach 2:
The invention employs pneumatic principles by using vacuum pressure differential to achieve chip ejection. The ejecting device creates a vacuum field that adsorbs chips and pushes them upward for separation from the mount tape, replacing the mechanical force application method with a non-contact pneumatic approach that minimizes stress on fragile chips.
2Strength
If vacuum holes are provided in the ejecting device body, then stress on chips is minimized during pickup, but device complexity increases
Solution Approach 1:
The ejecting device body is designed with multiple vacuum holes, effectively creating a porous structure that enables vacuum adsorption functionality. This porous design allows the device to apply distributed vacuum pressure across multiple chip contact points, minimizing stress concentration on individual chips while achieving effective pickup and separation.
Solution Approach 2:
The vacuum system is segmented into multiple vacuum holes distributed across the ejecting device body. This segmentation allows the vacuum force to be applied at multiple discrete locations, enabling simultaneous adsorption and ejection of multiple chips or sequential processing with reduced stress on each chip compared to a single-point mechanical contact system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus reduces stress on semiconductor chips, preventing damage and enhancing pickup efficiency, especially for miniaturized and thinned chips.
Implementation Method 1
the body sucks the air through the plurality of vacuum holes to adsorb and fix semiconductor chips downward along the first direction
Data Source
AI summary
An apparatus for ejecting a chip is provided. The apparatus for ejecting the chip includes a body formed with a plurality of vacuum holes, and an ejecting bar provided in the body and driven to ascend and descend along a first direction, wherein the ejecting bar is driven upward along the first direction to push up a target semiconductor chip attached onto a mount tape so that a collet device adsorbs and picks up the target semiconductor chip, and the body sucks the air through the plurality of vacuum holes to adsorb and fix semiconductor chips downward along the first direction, which are attached onto the mount tape by being disposed to be adjacent to the mount tape and the target semiconductor chip.