Vacuum Chip Peeling Control for Thin Wafer Integrity
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Solution Overview
Problem
Existing chip peeling apparatuses are complex, occupy significant device space, and are prone to causing cracks or breakage due to the thinness of chips and sharp pins used for peeling.
Innovation Solution
A chip peeling apparatus with a housing featuring a seating surface, recessed portion, vacuum suction holes, blow holes, and a protrusion, controlled by a controller that adjusts fluid flow rate based on vacuum pressure to manage peeling and minimize chip deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a sharp pin is used to push up thin chips for peeling, then the peeling process can be performed, but cracks or breakage occur in the chip
Solution Approach 1:
The patent replaces the mechanical sharp pin pushing method with a vacuum suction system that uses negative pressure to hold and peel chips. The vacuum suction holes apply uniform suction force across the chip surface, eliminating the concentrated stress from sharp pins that causes cracking and breakage in thin chips
Solution Approach 2:
The patent employs vacuum suction (pneumatic principle) to hold the chip on the seating surface and the dicing tape on the block portion. By controlling the vacuum pressure through the vacuum suction source, the system can securely hold thin chips without mechanical contact, thereby preventing chip damage during the peeling process
2Productivity
If existing chip peeling apparatuses are used, then peeling can be performed, but the apparatus is complicated and occupies significant device space
Solution Approach 1:
The patent integrates multiple functions into a unified structure: the seating surface with vacuum suction holes directly holds the chip, the block portion with recessed portion and vacuum suction holes holds the dicing tape, and the protrusion provides mechanical support. This merged design eliminates the need for separate complex mechanisms while maintaining effective peeling capability
Solution Approach 2:
The vacuum suction source serves multiple functions: it holds the chip on the seating surface, holds the dicing tape on the block portion, and enables peeling by differentially releasing the vacuum. This multi-functional approach reduces the number of separate components needed, simplifying the overall apparatus structure
3Productivity
If existing chip peeling apparatuses are used, then peeling can be performed, but the apparatus is large
Solution Approach 1:
The patent employs a nested structure where the recessed portion is formed within the block portion, and the protrusion extends into the recessed portion. The vacuum suction holes are integrated into the seating surface and block portion structure. This nesting arrangement maximizes functional density within a compact volume, reducing the overall apparatus size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces cracking and breaking of thin chips by controlled vacuum suction and pressurization, allowing for a more compact apparatus design and faster peeling times.
Implementation Method 1
a vacuum suction source configured to evacuate the first vacuum suction hole and the second vacuum suction hole
Implementation Method 2
a pressurization source configured to send a fluid to the blow hole
Data Source
AI summary
A chip peeling apparatus is provided that includes a housing having a seating surface for mounting a wafer, a recessed portion and a first vacuum suction hole in the seating surface, and a second vacuum suction hole, a blow hole and a protrusion in the recessed portion. The chip peeling apparatus further includes: a vacuum suction source that evacuates the first vacuum suction hole and the second vacuum suction hole; a pressure detector that detects a degree of vacuum of the second vacuum suction hole; a pressurization source that sends a fluid to the blow hole; a flow rate control valve; and a controller that determines a flow rate of the fluid to be sent to the blow hole, based on the degree of vacuum, and controls, via the flow rate control valve, the fluid sent from the pressurization source to flow at the determined flow rate.