Vacuum Chuck With Annular Suction For Structured Wafer Holding

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Solution Overview

Problem

Existing receiving devices for structured substrates in the semiconductor industry face challenges in securely and gently fixing thinner wafers with pronounced topography, as traditional methods like electrostatic fixation can damage electrical circuits and introduce contamination, and existing vacuum chucks provide uneven pressure distribution.

Innovation Solution

A modified vacuum chuck design that creates a homogeneous suction effect across the structured surface of the substrate by using a fluid flow system with a narrow annular suction surface and adjustable intake channels, ensuring a linearly variable surface force and minimizing stress on the wafer, while avoiding full-area pressurization and using an elastic coating to protect sensitive structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If electrostatic fixing is used to hold the substrate, then the substrate can be securely fixed, but the electrical circuits of the structures can be destroyed by voltage spikes and contamination is introduced

Engineering Contradiction:

Improvefixing securityVSAvoidvoltage spike damage and contamination

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces electrostatic fixing with a mechanical vacuum-based fixing system. The receiving device uses vacuum pressure applied through a receiving surface to mechanically hold the substrate, eliminating the need for electrostatic fields that could damage sensitive electrical circuits or introduce contamination.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent employs vacuum pressure (pneumatic principle) to secure the substrate. A vacuum is generated in a receiving chamber and applied uniformly across the receiving surface, creating a holding force that secures the substrate without contact or harmful fields, allowing for clean and damage-free fixation.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Reliability

If full-surface pressure application is used in vacuum chucks, then the substrate can be held securely, but the pressure distribution becomes uneven across the structured surface

Engineering Contradiction:

Improveholding securityVSAvoidpressure distribution uniformity

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

The patent applies vacuum pressure locally and uniformly across the entire receiving surface through a vacuum chamber design. The receiving surface is exposed to the vacuum environment, allowing uniform pressure distribution across all areas of the substrate in contact with the receiving surface, accommodating structured surfaces with varying topography.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The receiving device uses multiple separate receiving surfaces or zones that can independently contact different areas of the substrate. This segmentation allows each zone to adapt to local surface variations while collectively providing secure holding across the entire substrate, improving both security and pressure uniformity.

Inventive Principle:

Principle #1Segmentation

3Adaptability or versatility

If the wafer thickness is reduced to meet miniaturization requirements, then device integration is improved, but fixing the wafer becomes increasingly difficult

Engineering Contradiction:

Improvedevice miniaturizationVSAvoidfixing difficulty

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The vacuum-based pneumatic fixing system provides distributed pressure across the entire receiving surface, creating uniform holding force that is effective regardless of wafer thickness. The vacuum pressure acts on the exposed surface area rather than concentrating force at specific points, making it suitable for holding thin, fragile wafers securely.

Inventive Principle:

Principle #29Pneumatics and hydraulics

Solution Approach 2:

The receiving surface may incorporate curved or conformal geometries that adapt to the wafer surface, ensuring consistent contact and pressure distribution even for thin wafers with varying topography. This curvature adaptation helps maintain reliable fixing while accommodating miniaturized device structures.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables secure, contamination-free, and reversible handling of substrates with a uniform pressure distribution, reducing the risk of damage and contamination, and allowing for precise control of the surface force applied to the substrate.

Implementation Method 1

a controllable extraction device for generating a fluid flow along a flow channel with an inflow surface facing away from the structural side of the substrate and an outflow surface opposite the inflow surface

Methodology Applied

Scientific EffectVacuum suction: Suction

Implementation Method 2

The receiving surface is formed by an elastic base body and/or an elastic coating

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentEP2729962B1Holding device for holding a patterned wafer

Publication Date: 2019.11.13 EV GRP E THALLNER GMBH

Figure 1a~1b
Figure 2a~2c
Figure 3~4

AI summary

This invention relates to a mounting apparatus for mounting and supporting one structure side of a substrate, which structure side has structures thereon. The apparatus having a mounting element with a flat mounting surface for supporting the structures and a suction surface F2 which penetrates the mounting surface solely in an outer ring surface for effecting a fluid flow which produces suctions on the substrate.