Vacuum Chuck Gap Expansion for Wafer Die Cleaning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wafer processing apparatuses face challenges in efficiently removing foreign materials from gaps between dies during cleaning, leading to increased cleaning time and potential damage to the apparatus due to cumbersome sealing ring coupling and alignment issues, resulting in a complex structure and higher manufacturing costs.
Innovation Solution
A wafer processing apparatus with a rotating chuck, vacuum chuck, and a moving module that increases the gap between adjacent dies by moving the vacuum chuck or chuck module, allowing for improved cleaning performance through the use of a medium flow path, cylinder, or solenoid to facilitate the removal of foreign materials with a cleaning solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing ring is coupled to the rotating table to prevent treatment solution leakage, then sealing performance is improved, but the coupling process becomes cumbersome and coupling errors occur leading to misalignment
Solution Approach 1:
The patent replaces the mechanical coupling system with a magnetic coupling system. The sealing ring includes a magnetic coupling portion that magnetically couples with the rotating table, eliminating the need for mechanical fasteners and complex alignment procedures. This magnetic coupling maintains reliable sealing while simplifying the coupling process and preventing misalignment issues.
Solution Approach 2:
The patent changes the coupling mechanism from mechanical to magnetic by introducing magnetic coupling portions with specific magnetic strengths. This parameter change allows the sealing ring to be easily attached and detached while maintaining reliable sealing performance, resolving the contradiction between sealing reliability and coupling complexity.
2Reliability
If the cleaning time is extended to remove foreign materials from gaps between dies, then cleaning performance is improved, but the processing time increases
Solution Approach 1:
The patent introduces a moving module that dynamically adjusts the gap between adjacent dies during the cleaning process. By increasing the gap between dies, the cleaning solution can more effectively reach and remove foreign materials from previously inaccessible areas. This dynamic adjustment improves cleaning performance without requiring extended cleaning time, as the enhanced solution penetration achieves better cleaning results more quickly.
Solution Approach 2:
The moving module acts as an intermediary that facilitates better cleaning solution access to the gap areas between dies. By temporarily increasing the gap, it enables the cleaning solution to penetrate more effectively, achieving superior cleaning performance in reduced time without requiring prolonged exposure.
3Manufacturing precision
If wafer fixing module and sealing ring fixing module are installed to prevent position variation, then positioning accuracy is improved, but the apparatus structure becomes complicated and manufacturing cost increases
Solution Approach 1:
The patent merges the sealing ring fixing function with the magnetic coupling system. The magnetic coupling portions serve dual purposes: they secure the sealing ring to the rotating table while also maintaining precise positioning. This consolidation eliminates the need for separate wafer fixing modules and sealing ring fixing modules, reducing structural complexity while maintaining positioning accuracy.
Solution Approach 2:
The magnetic coupling system performs multiple functions simultaneously: it provides sealing, prevents leakage, and maintains precise positioning of both the sealing ring and wafer. This multi-functional design replaces multiple specialized modules, simplifying the overall apparatus structure while preserving positioning accuracy and reducing manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances cleaning performance by allowing for efficient removal of foreign materials from both die surfaces and gaps, reducing the defective rate and processing time while simplifying the apparatus structure and reducing manufacturing costs.
Implementation Method 1
a first vacuum chuck installed in the rotating chuck to be rotated together with the rotating chuck and configured to form a vacuum pressure to suction the wafer
Data Source
AI summary
A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.