Vacuum Chuck With Micro Grooves For Bent Substrate Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing vacuum chucks face challenges in stably mounting bent substrates with improved heat transfer and reduced risk of physical damage, while maintaining sufficient suction power and efficient heat transmission.
Innovation Solution
A vacuum chuck design featuring a pedestal with a vacuum groove and hole configuration, a heater, and a gas hole system, where the vacuum hole diameter ranges from 2 to 3 micrometers and the groove width from 1.6 to 2.5 micrometers, along with a gas pipe and bottom gas supply, to provide enhanced suction and heat transfer while minimizing physical damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum hole diameter is increased to improve suction power, then mounting stability is improved, but heat transfer performance deteriorates
Solution Approach 1:
The patent optimizes the vacuum hole diameter within a specific range (2-3 micrometers) to balance suction power and heat transfer. This parameter optimization allows the system to maintain adequate mounting stability while preserving thermal contact between the substrate and pedestal, resolving the contradiction between these two requirements.
2Reliability
If vacuum groove width is increased to improve suction power, then mounting stability is improved, but heat transfer performance deteriorates
Solution Approach 1:
The patent specifies a vacuum groove width range (1.6-2.5 micrometers) that optimizes the balance between suction effectiveness and thermal conduction. By controlling the groove width within this range, the design maintains mounting stability while minimizing the impact on heat transfer between the substrate and the heater.
3Reliability
If vacuum pressure is increased to improve mounting stability, then substrate holding is improved, but risk of physical damage increases
Solution Approach 1:
The patent divides the vacuum application into multiple small vacuum holes and grooves rather than using a single large vacuum area. This segmentation distributes the suction force across many small contact points, preventing concentrated stress that could damage the substrate while maintaining adequate overall holding force.
Solution Approach 2:
The patent optimizes the dimensions of vacuum holes (2-3 micrometers) and grooves (1.6-2.5 micrometers) to achieve effective substrate holding with reduced risk of physical damage. These parameter changes ensure that the vacuum force is applied in a controlled manner that prevents substrate deformation or breakage.
4Temperature
If vacuum hole diameter is reduced to improve heat transfer, then heat transmission is improved, but suction power deteriorates
Solution Approach 1:
The patent uses multiple small vacuum holes (2-3 micrometers each) distributed across the substrate surface. While each individual hole is small for heat transfer, the collective effect of multiple holes provides sufficient total suction power, thus resolving the contradiction between heat transmission and suction power.
Solution Approach 2:
The patent specifies a vacuum hole diameter range (2-3 micrometers) that optimizes the balance between heat transfer efficiency and suction power. This parameter control ensures adequate thermal contact while maintaining necessary vacuum holding force.
5Temperature
If vacuum groove width is reduced to improve heat transfer, then heat transmission is improved, but suction power deteriorates
Solution Approach 1:
The patent controls the vacuum groove width within a specific range (1.6-2.5 micrometers) to optimize the balance between heat transmission and suction power. This parameter optimization ensures that the grooves are narrow enough for heat transfer but wide enough to provide adequate vacuum holding force.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables stable mounting of bent substrates with improved heat transfer performance and reduced risk of physical damage, maintaining effective suction power and efficient heat transmission.
Implementation Method 1
the vacuum groove and vacuum hole form a vacuum passage configured to provide a vacuum pressure below the substrate
Implementation Method 2
a heater in the pedestal, the heater being configured to generate heat
Data Source
AI summary
A vacuum chuck includes a pedestal including a first surface on which a substrate may be mounted. The first surface of the substrate may include a vacuum hole to provide a vacuum pressure below the substrate, a vacuum groove connected to the vacuum hole, and a gas hole surrounding the vacuum groove to transmit a bottom gas to the substrate. A vacuum pipe may be provided to connect to the vacuum hole, and a gas pipe may be provided to connect to the gas hole. The diameter of the vacuum hole may be about 2 to about 3 micrometers, and a width of the vacuum groove may be about 1.6 to about 2.5 micrometers.