Vacuum Chuck Segmented Seal Troughs Wafer Stability
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Solution Overview
Problem
Existing vacuum chucks for semiconductor wafers have weak airtightness, leading to unstable and insecure holding of wafers, which can result in wafer damage during processing.
Innovation Solution
A vacuum chuck design featuring a supporting assembly with first and second receiving grooves, seal units, and a chuck connector that includes vacuum apertures and ports, utilizing seal rings to create a secure vacuum trough for holding and positioning wafers, with a network of vacuum passageways and hoses for evacuating air and maintaining a stable vacuum seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional vacuum chuck designs are used, then the structure is simple, but the airtightness is weak causing unstable wafer holding
Solution Approach 1:
The chuck is divided into multiple functional components: a body with first vacuum trenches, a wafer holder with second vacuum trenches, and seal rings positioned between them. Each component has specific vacuum trenches that work together to create multiple sealed vacuum zones, improving overall airtightness through segmented vacuum chambers rather than a single large chamber.
Solution Approach 2:
The wafer holder is nested within the body structure, with the second vacuum trenches in the wafer holder positioned inside the region defined by the first vacuum trenches in the body. The seal rings are nested between these two components, creating a nested configuration where inner vacuum trenches are surrounded by outer vacuum trenches, forming concentric vacuum zones that enhance sealing.
2Reliability
If weak airtightness design is used, then the device is simple to manufacture, but the wafer may come off and get damaged
Solution Approach 1:
Seal rings made of elastomeric material are used to create flexible sealing interfaces between the body and wafer holder. These elastomeric seal rings can deform to conform to surface irregularities, providing reliable airtight sealing without requiring extremely precise rigid machining, thus maintaining ease of manufacture while improving wafer holding security.
3Reliability
If multiple seal rings and vacuum trenches are added, then airtightness improves, but the device complexity increases
Solution Approach 1:
The body and wafer holder are merged into a integrated assembly where the wafer holder is positioned within the body and secured through fastening members. The multiple vacuum trenches (first in the body, second in the wafer holder) are merged into a unified vacuum system that works together, with seal rings combining the sealing functions of both components. This merging reduces the need for separate external sealing mechanisms.
Solution Approach 2:
The wafer holder serves multiple functions: it provides second vacuum trenches for enhanced sealing, acts as a support structure for the wafer, and serves as a mounting platform for the seal rings. The body simultaneously provides first vacuum trenches, structural support, and housing for the overall assembly. This multi-functionality reduces the need for additional dedicated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved vacuum chuck provides stable and secure holding and positioning of semiconductor wafers, preventing damage by enhancing airtightness and ensuring consistent vacuum retention.
Implementation Method 1
at least one vacuum hose connects the first vacuum aperture, the second vacuum aperture with the vacuum orifice and the vacuum port of the chuck connector for evacuating the air of the vacuum trough to hold and position the wafer on the seal rings and the supporting assembly
Data Source
AI summary
A vacuum chuck is disclosed for holding and positioning wafers more stably and securely. The vacuum chuck includes a supporting assembly having a receiving groove and at least one first vacuum aperture defined in the receiving groove. A seal unit includes a seal ring bulging to form a vacuum trough. The seal ring is fixed in the receiving groove of the supporting assembly and has at least one second vacuum aperture communicating with the first vacuum aperture. A chuck connector fastened with the supporting assembly has at least one vacuum port and at least one vacuum orifice communicating with the vacuum port. At least one vacuum hose connects the first vacuum aperture, the second vacuum aperture with the vacuum orifice and the vacuum port of the chuck connector for evacuating the air of the vacuum trough to hold and position the wafer on the seal ring and the supporting assembly.