Vacuum Chuck Sealing for Flattening Warped Semiconductor Substrates
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Solution Overview
Problem
Thermal issues during semiconductor substrate fabrication, caused by varying coefficients of thermal expansion (CTEs) of different materials, lead to warpage, which existing handling apparatuses are not entirely effective in controlling, affecting the performance and yield of semiconductor substrates.
Innovation Solution
A semiconductor apparatus equipped with a chuck table and a flexible member that forms a seal around vacuum channels to securely hold warped semiconductor substrates, using a vacuum to flatten them by compressing the flexible member and eliminating gaps between the substrate and the chuck table, thereby preventing vacuum leakage and ensuring proper handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If existing handling apparatus are used to hold semiconductor substrates, then the substrates can be handled for subsequent processes, but the apparatus are not entirely effective in controlling warpage caused by thermal expansion differences, leading to reduced manufacturing precision
Solution Approach 1:
The patent employs a dynamic vacuum distribution system that can independently control vacuum pressure in different zones (central, intermediate, and peripheral regions) of the chuck table. This dynamic control allows the system to adapt to substrates with varying degrees of warpage by applying appropriate vacuum forces to specific regions, thereby improving both substrate flatness control and vacuum seal effectiveness simultaneously
Solution Approach 2:
The chuck table is divided into multiple vacuum zones with different vacuum pressure levels. The central region, intermediate region, and peripheral region each have independent vacuum control, allowing local adjustment of vacuum strength to match the local warpage characteristics of the substrate. This local quality approach enables precise control of substrate flatness while maintaining reliable vacuum sealing across the entire substrate surface
2Reliability
If vacuum pressure is increased to improve substrate holding, then substrate movement is prevented, but warped substrates may not be properly flattened and vacuum leakage may occur
Solution Approach 1:
The vacuum system is segmented into multiple independent zones (central, intermediate, and peripheral regions) that can operate at different vacuum pressure levels. This segmentation allows the peripheral zones to apply stronger vacuum for sealing warped substrate edges, while the central zone maintains appropriate vacuum for flat substrate holding, thereby preventing both vacuum leakage and substrate movement simultaneously
Solution Approach 2:
The system dynamically changes vacuum pressure parameters across different spatial zones and time sequences. By adjusting vacuum pressure levels in each zone independently and controlling the timing of vacuum application, the system optimizes both substrate holding stability and flatness control, preventing vacuum leakage while maintaining proper substrate contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively flattens warped semiconductor substrates, ensuring accurate and reliable handling for subsequent processes, improving manufacturing yield by maintaining a secure vacuum seal and preventing substrate movement during operations.
Implementation Method 1
introducing a vacuum in vacuum holes in the chuck table to form a vacuum seal among the semiconductor substrate, the chuck table, and the first flexible member
Implementation Method 2
a flexible member that forms a seal around vacuum channels to securely hold warped semiconductor substrates
Data Source
AI summary
A method for handling a semiconductor substrate includes: placing a semiconductor substrate over a semiconductor apparatus, where a central portion of the semiconductor substrate overlies a carrying surface of a chuck table of the semiconductor apparatus, an edge portion of the semiconductor substrate overlies a top surface of a first flexible member of the semiconductor apparatus, the first flexible member is disposed within a recess of the chuck table and extends along a perimeter of the carrying surface, and a gap forms among the semiconductor substrate, the carrying surface of the chuck table, and the top surface of the first flexible member; and introducing a vacuum in vacuum holes in the chuck table to form a vacuum seal among the semiconductor substrate, the chuck table, and the first flexible member.