Vacuum Chuck Assembly for Wafer-Level Package Handling
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Solution Overview
Problem
The handling and inspection of wafer-level package assemblies in various shapes and sizes pose challenges due to difficulties in securing and processing these assemblies during redistribution layer applications and inspections.
Innovation Solution
A chuck assembly with a planar support surface and elastomeric seal, combined with a clamping mechanism and latch mechanisms, secures the wafer-level package assembly using vacuum pressure and adjustable latch mechanisms to facilitate inspection and handling, allowing for translation and secure attachment to a material handling system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wafer-level package assemblies are handled without specialized securing mechanisms, then handling simplicity is maintained, but handling reliability deteriorates due to difficulty in securing assemblies of various shapes and sizes
Solution Approach 1:
The chuck assembly is designed with a universal planar support surface that can accommodate wafer-level package assemblies of various shapes and sizes. The elastomeric seal creates a vacuum bond that adapts to different geometries, allowing a single device to handle multiple assembly types without requiring specialized fixtures for each shape.
Solution Approach 2:
The system employs vacuum pressure through the elastomeric seal to secure the wafer-level package assembly to the planar support surface. This pneumatic mechanism provides reliable holding force without mechanical clamps or fasteners, enabling secure handling while maintaining operational simplicity.
2Reliability
If clamping mechanisms are applied to secure wafer-level package assemblies, then handling reliability is improved, but ease of operation deteriorates due to complexity in applying and releasing clamps
Solution Approach 1:
Instead of mechanical clamps requiring manual application and release, the system uses vacuum pressure applied through the elastomeric seal to secure the assembly. The vacuum bond is created by lowering pressure beneath the seal, and released by equalizing pressure, providing a simpler operational sequence compared to mechanical clamping.
Solution Approach 2:
The invention replaces the mechanical clamp system with a vacuum-based holding mechanism. This substitution eliminates the need for physical clamps that must be positioned and secured, replacing them with a pressure differential system that automatically bonds the assembly to the planar support surface when vacuum is applied.
3Ease of operation
If vacuum seals are used to secure wafer-level package assemblies, then ease of operation is improved, but reliability deteriorates due to difficulty in maintaining vacuum pressure
Solution Approach 1:
The elastomeric seal is made from flexible material that can conform to the wafer-level package assembly and maintain a reliable vacuum bond. The flexibility of the elastomeric material allows it to adapt to slight variations in assembly geometry while maintaining seal integrity, ensuring both ease of operation and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient inspection and handling of wafer-level package assemblies by providing a secure and adaptable solution for various shapes and sizes, ensuring effective application of redistribution layers and processing tasks.
Implementation Method 1
The elastomeric ring creates a seal and a vacuum source is used to urge the package against the surface
Data Source
AI summary
A chuck assembly includes an upper surface configured to support a wafer-level package assembly and a clamping mechanism securing the wafer-level package assembly to the upper surface.